MOLYBDENUM SPUTTERING TARGET WITH HIGH TRANSVERSE RUPTURE STRENGTH
A molybdenum sputtering target assembly includes molybdenum sputtering target diffusion bonded directly to a molybdenum backing plate. The molybdenum sputtering target consists of molybdenum and the molybdenum backing plate consists of molybdenum or a molybdenum alloy.
1 . A method for selecting molybdenum powder for a powder metallurgy sputtering target, the method comprising:
vacuum hot pressing a sample high purity powder molybdenum from a source to form a specimen;
determining a transverse rupture strength of the specimen; and
selecting the source for powder molybdenum for manufacture of powder metallurgy molybdenum sputtering targets if the transverse rupture strength of the specimen is greater than or equal to a predetermined value.
2 . The method of claim 1 , wherein the predetermined value is about 120 ksi (827 MPa).
3 . The method of claim 1 , wherein the sample high purity powder molybdenum consists of molybdenum and inevitable impurities.
4 . The method of claim 1 , wherein the predetermined value is about 150 ksi (1034 MPa).
5 . The method of claim 1 , wherein transverse rupture strength is determined by ASTM B528-16.
6 . A sputtering target assembly comprising:
a powder metallurgy high purity molybdenum sputtering target having a transverse rupture strength of at least 120 ksi (827 MPa); and
a copper alloy backing plate diffusion bonded to the sputtering target.
7 . The sputtering target assembly of claim 6 , wherein the sputtering target has a transverse rupture strength of at least 150 ksi (1034 MPa).
8 . The sputtering target assembly of claim 6 , wherein the copper alloy backing plate is a copper-zinc backing plate.
9 . The sputtering target assembly of claim 6 , wherein the high purity molybdenum sputtering target consists of molybdenum and inevitable impurities.
10 . The sputtering target assembly of claim 6 , wherein an aluminum interlayer is between the powder metallurgy high purity molybdenum sputtering target and the copper alloy backing plate.
11 . A method of making a sputtering target assembly, the method comprising:
selecting a powder molybdenum wherein the powder molybdenum produces a specimen having a transverse rupture strength of at least a predetermined value;
forming the powder metallurgy sputtering target from the selected powder molybdenum; and
attaching the powder metallurgy sputtering target to a backing plate, wherein the predetermined value is 120 ksi (827 MPa).
12 . The method of claim 11 , wherein the powder molybdenum consists of molybdenum and inevitable impurities.
13 . The method of claim 11 , wherein the predetermined value is 150 ksi (1034 MPa).
14 . The method of claim 11 , wherein transverse rupture strength is determined by ASTM B528-16.
15 . The method of claim 11 , wherein attaching the powder metallurgy sputtering target to a backing plate includes attaching the powder metallurgy sputtering target to a copper alloy backing plate.
16 . The method of claim 15 , wherein attaching the powder metallurgy sputtering target to a copper alloy backing plate includes diffusion bonding the powder metallurgy sputtering target to a copper alloy backing plate.
17 . The method of claim 15 , wherein the copper alloy backing plate is a copper-zinc backing plate.
18 . The method of claim 17 , and further including an aluminum interlayer between the copper-zinc backing plate and the powder metallurgy sputtering target.
19 . The method of claim 11 , wherein before selecting the powder molybdenum a specimen is formed using the powder molybdenum, and the transverse rupture strength of the specimen is determined.
20 . The method of claim 11 , wherein forming the powder metallurgy sputtering target includes hot pressing the selected powder molybdenum.