SYSTEM AND METHOD OF PROCESSING SEMICONDUCTOR STRUCTURE
A method of processing a semiconductor structure includes: providing the semiconductor structure which includes a substrate and a semiconductor stack connected to a first surface of the substrate; and providing a light beam to pass through the substrate for irradiating the first surface to separate the substrate and the semiconductor stack. The first surface extends along a horizontal direction and has a first protruding unit and a second protruding unit which are arranged adjacent to each other. The first protruding unit has a top, and a first inclined surface and a second inclined surface which are located at two sides of the top. The light beam includes a first sub-beam arranged for perpendicularly irradiating the first inclined surface.
1 . A method of processing a semiconductor structure, comprising:
providing the semiconductor structure which comprises a substrate and a semiconductor stack, wherein the substrate has a first surface connected to the semiconductor stack and extending along a horizontal direction, the first surface has a first protruding unit and a second protruding unit which are arranged adjacent to each other, the first protruding unit has a top, and a first inclined surface and a second inclined surface which are located on two sides of the top; and
providing a light beam to pass through the substrate for irradiating the first surface to separate the substrate and the semiconductor stack, wherein the light beam comprises a first sub-beam arranged for perpendicularly exiting the first inclined surface.
2 . The method of claim 1 , wherein the light beam further comprises a second sub-beam arranged for perpendicularly exiting the second inclined surface.
3 . The method of claim 1 , wherein the substrate further comprises a depression located between the first protruding unit and the second protruding unit, and the light beam further comprises a third sub-beam arranged for exiting the top, and a fourth sub-beam arranged for exiting the depression, and the third sub-beam and the fourth sub-beam are substantially perpendicular to the horizontal direction.
4 . The method of claim 1 , wherein the light beam is arranged for forming a uniform energy distribution on the first surface.
5 . The method of claim 1 , wherein the light beam is arranged for forming a non-Gaussian energy distribution on the first surface.
6 . A method of processing a semiconductor structure, comprising:
providing the semiconductor structure which comprises a substrate and a semiconductor stack, wherein the substrate has a first surface connected to the semiconductor stack, and a second surface arranged in a position opposite to the first surface, and the first surface has a plurality of protruding units; and
providing a light beam for irradiating the first surface through the second surface;
wherein the light beam comprises a plurality of sub-beams, and the plurality of sub-beams has a first projection area when perpendicularly irradiating onto the first surface, and a second projection area when perpendicularly irradiating onto the second surface, the second projection area is smaller than that first projection area.
7 . The method of claim 6 , wherein the light beam is arranged for forming an uneven energy distribution on the second surface.
8 . The method of claim 6 , wherein the light beam is arranged for forming a uniform energy distribution on the first surface.
9 . A processing system, comprising:
a laser source, configured to provide a light beam;
a carrier, configured to support a semiconductor structure which comprises a substrate and a semiconductor stack, the substrate has a first surface connected to the semiconductor stack, and the first surface has a plurality of protruding units arranged in an array; and
an optical module, comprising a lens array, and arranged to guide the light beam to pass through the substrate and form a uniform energy distribution on the first surface.
10 . The processing system of claim 9 , wherein the plurality of protruding units comprises a first protruding unit, and the first protruding unit has a top, and a first inclined surface and a second inclined surface which are located on two sides of the top, the light beam comprises a first sub-beam arranged to exit the first inclined surface by a first incident angle and a second sub-beam arranged to exit the second inclined surface by an second incident angle, and the first incident angle and second incident angle are both less than 10 degrees.
11 . The processing system of claim 10 , wherein the first sub-beam is formed through the optical module.
12 . The processing system of claim 9 , wherein the lens array comprises a plurality of lens components, and the plurality of lens components and the plurality of protruding units have identical or similar arrangements.
13 . The processing system of claim 9 , wherein the lens array comprises a plurality of lens components arranged in a closest packed arrangement.