Thermally Conductive Structure, Electronic Device, and Terminal
A thermally conductive structure includes a thermally conductive part and an insulating ring. An upper side and a lower side of the thermally conductive part are at least partially exposed so that the thermally conductive part can be in contact with a heating component and a heat sink on the two sides to conduct heat. The insulating ring insulates the thermally conductive part around a periphery of the thermally conductive part.
1 . A thermally conductive structure comprising:
an insulating ring comprising an opening; and
a thermally conductive part disposed within the insulating ring.
2 . The thermally conductive structure of claim 1 , wherein the insulating ring further comprises:
a first side comprising a first surface coplanar with a first surface of the thermally conductive part; and
a second side opposite the first side and comprising a second surface coplanar with a second surface of the thermally conductive part.
3 . The thermally conductive structure of claim 1 , wherein the insulating ring further comprises:
a first side comprising a first surface coplanar with a first surface of the thermally conductive part; and
a second side opposite the first side and comprising a second surface that is in a first plane parallel to a second plane of a second surface of the thermally conductive part.
4 . The thermally conductive structure of claim 1 , wherein the insulating ring further comprises:
a first side comprising a first surface that is in a first plane parallel to a second plane of a first surface of the thermally conductive part; and
a second side opposite the first side and comprising a second surface that is in a third plane parallel to a fourth plane of a second surface of the thermally conductive part.
5 . The thermally conductive structure of claim 1 , wherein the insulating ring is fastened to the thermally conductive part.
6 . The thermally conductive structure of claim 1 , wherein the insulating ring and the thermally conductive part form an integrated structure.
7 . The thermally conductive structure of claim 1 , further comprising a gap between the insulating ring and the thermally conductive part.
8 . The thermally conductive structure of claim 1 , wherein the insulating ring further comprises foam, rubber, or sealant.
9 . The thermally conductive structure of claim 1 , wherein the insulating ring further comprises thermally conductive material.
10 . The thermally conductive structure of claim 9 , wherein the thermally conductive material further comprises a thermally conductive gel, a thermally conductive insulating tape, a thermally conductive adhesive, or a thermally conductive insulating film.
11 . The thermally conductive structure of claim 1 , wherein a thermally conductive coefficient of the thermally conductive part is greater than or equal to 10 watts/meter kelvin (W/(m·K)).
12 . The thermally conductive structure of claim 1 , wherein the thermally conductive part comprises carbon fiber or graphene.
13 . The thermally conductive structure of claim 1 , wherein an inner edge shape of the insulating ring conforms to an outer edge shape of the thermally conductive part.
14 . An electronic device, comprising:
a heating component;
a heat sink; and
a thermally conductive structure disposed between the heating component and the heat sink, and comprising:
an insulating ring comprising an opening; and
a thermally conductive part disposed within the insulating ring.
15 . The electronic device of claim 14 , wherein a first side of the insulating ring is disposed in contact with the heating component, and wherein a second side of the insulating ring is disposed in contact with the heat sink.
16 . The electronic device of claim 14 , further comprising a circuit board, wherein the heating component is disposed on a circuit board, wherein a first side of the insulating ring is disposed in contact with the circuit board, and wherein a second side of the insulating ring is disposed in contact with the heat sink.
17 . The electronic device of claim 14 , wherein the electronic device is a vehicle-mounted electronic device.
18 . A terminal comprising:
an electronic device comprising:
a heating component;
a heat sink; and
a thermally conductive structure disposed between the heating component and the heat sink, wherein the thermally conductive structure comprises:
an insulating ring comprising an opening; and
a thermally conductive part disposed within the insulating ring.
19 . The terminal of claim 18 , wherein the insulating ring further comprises:
a first side comprising a first surface coplanar with a first surface of the thermally conductive part; and
a second side opposite the first side and comprising a second surface coplanar with a second surface of the thermally conductive part.
20 . The terminal of claim 18 , wherein the insulating ring further comprises:
a first side comprising a first surface coplanar with a first surface of the thermally conductive part; and
a second side opposite the first side and comprising a second surface that is in a first plane parallel to a second plane of a second surface of the thermally conductive part.