ARRAY ANTENNA MODULE
An array antenna module includes a housing including heat sinks, and a holder configured to hold the heat sinks, substrates provided between the heat sinks, where each substrate has an edge, antennas configuring an array antenna, where at least one antenna is provided on each substrate and the antennas are arranged at positions where radio waves are radiated from edges of the substrates toward an outer side of the substrates, and amplifiers provided on each substrate and electrically connected to the antennas. Each amplifier has a first surface provided on one substrate and a second surface opposite to the first surface and connected to one heat sink.
1 . An array antenna module comprising:
a housing including a plurality of layers of heat sinks, and a holder configured to hold the plurality of layers of heat sinks;
a plurality of substrates provided between the plurality of layers of heat sinks, each substrate of the plurality of substrates having an edge;
a plurality of antennas configuring an array antenna, at least one antenna of the plurality of antennas being provided on each substrate of the plurality of substrates, the plurality of antennas being arranged at positions where radio waves are radiated from a plurality of edges of the plurality of substrates toward an outer side of the plurality of substrates; and
a plurality of amplifiers provided on each substrate of the plurality of substrates and electrically connected to the plurality of antennas, each amplifier of the plurality of amplifiers having a first surface provided on one substrate of the plurality of substrates and a second surface opposite to the first surface and connected to one layer of heat sink of the plurality of layers of heat sinks.
2 . The array antenna module as claimed in claim 1 , wherein:
the plurality of the antennas and the plurality of the amplifiers are provided on each substrate of the plurality of substrates, and
the plurality of antennas are arranged along the edge of each substrate of the plurality of substrates.
3 . The array antenna module as claimed in claim 2 , wherein the housing includes a partition wall provided between the plurality of layers of heat sinks and configured to partition the plurality of amplifiers provided on each substrate of the plurality of substrates.
4 . The array antenna module as claimed in claim 3 , wherein:
each substrate of the plurality of substrates includes a metal layer provided on a surface thereof having the partition wall, and
the partition wall is connected to the metal layer.
5 . The array antenna module as claimed in claim 1 , further comprising:
an adhesive layer provided between the second surface and the one layer of heat sink of the plurality of layers of heat sinks.
6 . The array antenna module as claimed in claim 5 , wherein the adhesive layer is formed of an adhesive including a thermally conductive filler.
7 . The array antenna module as claimed in claim 1 , wherein:
the plurality of layers of heat sinks form a laminated structure including a plurality of laminated layers, and
each layer of the plurality of laminated layers is formed of at least one material selected from a group consisting of silicon carbide (Sic), silicon nitride (SiN), aluminum nitride (AN), silicon (Si), and metals.
8 . The array antenna module as claimed in claim 1 , wherein:
the plurality of layers of heat sinks form a laminated structure including a plurality of laminated layers, and
each layer of the plurality of laminated layers is formed of a plurality of materials selected from a group consisting of silicon carbide (SiC), silicon nitride (SiN), aluminum nitride (AlN), silicon (Si), and metals.
9 . The array antenna module as claimed in claim 2 , wherein a pitch of the plurality of antennas provided on each substrate of the plurality of substrates is shorter than one wavelength of the radio waves at an operating frequency of the plurality of antennas.