SEMICONDUCTOR DEVICE
A semiconductor device is provided, which includes an epitaxial structure. The epitaxial structure includes a first semiconductor structure, a second semiconductor structure, and an active region. The first semiconductor structure has a first conductivity type and includes a first intermediate layer and a first cladding layer. The second semiconductor structure has a second conductivity type. The active region is located between the first semiconductor structure and the second semiconductor structure. The first intermediate layer is located between the active region and the first cladding layer. The first intermediate layer includes P or As. The first intermediate layer and the first cladding layer include a first dopant. A maximum concentration of the first dopant in the first intermediate layer is greater than a maximum concentration of the first dopant in the first cladding layer.
1 . A semiconductor device, comprising:
an epitaxial structure, comprising:
a first semiconductor structure having a first conductivity type and comprising a first intermediate layer and a first cladding layer;
a second semiconductor structure having a second conductivity type; and
an active region located between the first semiconductor structure and the second semiconductor structure;
wherein the first intermediate layer is located between the active region and the first cladding layer and comprises P or As, the first intermediate layer and the first cladding layer comprise a first dopant, wherein a maximum concentration of the first dopant in the first intermediate layer is greater than a maximum concentration of the first dopant in the first cladding layer.
2 . The semiconductor device of claim 1 , wherein the first semiconductor structure further comprises a second intermediate layer located between the first intermediate layer and the first cladding layer.
3 . The semiconductor device of claim 2 , wherein the second intermediate layer comprises the first dopant, and a minimum concentration of the first dopant in the second intermediate layer is less than a minimum concentration of the first dopant in the first cladding layer.
4 . The semiconductor device of claim 3 , wherein the second semiconductor structure comprises a third intermediate layer and a second cladding layer, wherein the third intermediate layer is located between the active region and the second cladding layer.
5 . The semiconductor device of claim 4 , wherein the third intermediate layer and the second cladding layer comprise a second dopant different from the first dopant.
6 . The semiconductor device of claim 5 , wherein a maximum concentration of the second dopant in the third intermediate layer is greater than a maximum concentration of the second dopant in the second cladding layer.
7 . The semiconductor device of claim 6 , wherein the second semiconductor structure further comprises a fourth intermediate layer located between the third intermediate layer and the second cladding layer.
8 . The semiconductor device of claim 7 , wherein the fourth intermediate layer comprises the second dopant, and a minimum concentration of the second dopant in the fourth intermediate layer is less than a minimum concentration of the second dopant in the second cladding layer.
9 . The semiconductor device of claim 1 , wherein the first intermediate layer comprises a ternary or quaternary group III-V semiconductor material.
10 . The semiconductor device of claim 1 , wherein the maximum concentration of the first dopant in the first intermediate layer is in a range of 2×10 18 cm −3 to 8×10 18 cm −3 .
11 . The semiconductor device of claim 1 , wherein a minimum concentration of the first dopant in the first intermediate layer is greater than a minimum concentration of the first dopant in the first cladding layer.
12 . The semiconductor device of claim 1 , wherein a ratio of the maximum concentration of the first dopant in the first intermediate layer to the maximum concentration of the first dopant in the first cladding layer is in a range of 1 to 5.
13 . The semiconductor device of claim 1 , wherein the first semiconductor structure further comprising a second intermediate layer, and the first cladding layer is located between the first intermediate layer and the second intermediate layer.
14 . The semiconductor device of claim 13 , wherein the second intermediate layer comprise the first dopant, and a minimum concentration of the first dopant in the second intermediate layer is less than a minimum concentration of the first dopant in the first cladding layer.
15 . The semiconductor device of claim 1 , wherein the second semiconductor structure comprises a second intermediate layer and a second cladding layer.
16 . The semiconductor device of claim 15 , wherein the second intermediate layer is located between the active region and the second cladding layer.
17 . The semiconductor device of claim 15 , wherein the second cladding layer is located between the active region and the second intermediate layer.
18 . The semiconductor device of claim 15 , wherein the second intermediate layer and the second cladding layer comprise a second dopant different from the first dopant.
19 . The semiconductor device of claim 18 , wherein a minimum concentration of the second dopant in the second intermediate layer is less than a minimum concentration of the second dopant in the second cladding layer.
20 . A semiconductor component, comprising:
a carrier;
a semiconductor device located on the carrier and comprising:
an epitaxial structure, comprising:
a first semiconductor structure having a first conductivity type and comprising a first intermediate layer and a first cladding layer;
a second semiconductor structure having a second conductivity type; and
an active region located between the first semiconductor structure and the second semiconductor structure; and
a first conductive bump and a second conductive bump located between the semiconductor device and the carrier;
wherein the first intermediate layer is located between the active region and the first cladding layer and comprises P or As, the first intermediate layer and the first cladding layer comprise a first dopant, wherein a maximum concentration of the first dopant in the first intermediate layer is greater than a maximum concentration of the first dopant in the first cladding layer.