MICRO PROJECTOR AND SEMICONDUCTOR WAFER
A micro projector and a semiconductor wafer are provided. The micro projector includes a micro LED array display chip; and a lens group provided above the micro LED array display chip and supported by a bottom connector. The semiconductor wafer includes a micro LED wafer including a plurality of micro LED array display chips; and a plurality of lens wafers stacked on the micro LED wafer to form a micro projector array.
1 . A micro projector, comprising:
a micro LED array display chip; and
a lens group provided above the micro LED array display chip and supported by a bottom connector.
2 . The micro projector according to claim 1 , wherein the bottom connector is configured to connect the lens group and the micro LED array display chip.
3 . The micro projector according to claim 2 , wherein the micro LED array display chip comprises a micro LED array area for emitting light, and a non-functional area, wherein the bottom connector is provided on the non-functional area.
4 . The micro projector according to claim 1 , wherein the bottom connector comprises a sealant and a plurality of spacers.
5 . The micro projector according to claim 4 , wherein the spacer is rigid.
6 . The micro projector according to claim 5 , wherein the spacer is a ball.
7 . The micro projector according to claim 3 , wherein the micro projector further comprises a lens barrel provided around the lens group and on the non-functional area of the micro LED array display chip.
8 . The micro projector according to claim 7 , wherein the lens barrel is connected to an edge of the lens group.
9 . The micro projector according to claim 8 , wherein the lens barrel is provided on an edge surface of the micro LED array display chip.
10 . The micro projector according to claim 7 , wherein a surface of the micro LED array area is packaged or sealed by the lens group and the barrel.
11 . The micro projector according to claim 7 , wherein a top of the lens barrel is lower than a top of the lens group.
12 . The micro projector according to claim 3 , wherein the lens group comprises:
a plurality of optical lenses stacked from top to bottom without contacting from each other; and
a connection structure provided between adjacent optical lenses of the lens group for connecting and supporting the adjacent optical lens.
13 . The micro projector according to claim 12 , wherein an optical property of each of the optical lenses is different from optical properties of other ones of the plurality of optical lenses.
14 . The micro projector according to claim 12 , wherein each optical lens comprises
a curved portion configured to transmit light emitted from the micro LED array display chip; and
a flat portion configured to connect with the connection structure.
15 . The micro projector according to claim 14 , wherein the connection structure is connected to a surface of the flat portions of the adjacent optical lenses.
16 . The micro projector according to claim 14 , wherein each curved portion of the plurality of optical lenses corresponds to the micro LED array area of the micro LED array display chip.
17 . The micro projector according to claim 16 , wherein a projection of the curved portion on the micro LED array display chip covers the micro LED array area.
18 . The micro projector according to claim 16 , wherein a center axis of the micro LED array area is aligned with a center axis of the curved portion of each optical lens.
19 . The micro projector according to claim 17 , wherein a projection of the curved portion of a top-most one of the plurality of optical lenses covers a projection of the curved portion of other ones of the plurality of optical lenses.
20 . The micro projector according to claim 12 , wherein the lens group comprises a top biconvex lens, a convex lens, a middle biconvex lens, and a concave lens from top to bottom.
21 . The micro projector according to claim 14 , wherein a distance between adjacent flat portions of the adjacent optical lenses is not greater than 5 mm.
22 . A semiconductor wafer comprising:
a micro LED wafer comprising a plurality of micro LED array display chips; and
a plurality of lens wafers stacked on the micro LED wafer to form a micro projector array.
23 . The semiconductor wafer according to claim 22 , wherein the micro projector array comprises a plurality of micro projectors, each micro projector comprising:
a micro LED array display chip; and
a lens group provided above the micro LED array display chip and supported by a bottom connector.
24 . The semiconductor wafer according to claim 22 , further comprising a connection structure provided between adjacent ones of the lens wafers for connecting and supporting the adjacent lens wafers.
25 . The semiconductor wafer according to claim 23 , further comprising
a cutting pattern for cutting the micro projector array into the plurality of micro projectors.