ALKALI METAL OR ALLOY ANODE WITH UNIFORM LI PLATING AND STRIPPING INTERLAYER
Anode film stacks incorporating a constriction susceptible interlayer or a plating and stripping enhancement layer are provided. The anode film stack enables production of alkali-metal anodes or alkali metal alloy anodes with uniform Li plating and stripping performance, which can be used in an energy storage devices, for example, a battery or a capacitor. Methods and systems for forming the anode film stack are also provided.
1 . A method of making an electrode structure, comprising:
forming a film stack over a carrier substrate, comprising:
forming a plating and stripping enhancement film over the carrier substrate, the plating and stripping enhancement film comprising a constriction compliant material; and
forming an alkali metal-containing film on the plating and stripping enhancement film; and
transferring the film stack from the carrier substrate to a flexible conductive substrate to form an anode film stack, wherein the alkali metal-containing film contacts the flexible conductive substrate in the anode film stack.
2 . The method of claim 1 , wherein the constriction compliant material is selected from oxides of Mg, oxides of aluminum, oxides of silicon, Ag, Al, Bi, Mg, Sn, Zn, Cu, Si, alloys of Ag, Al, Bi, Mg, Zn, Cu, Sn, Si, silica coated Ag, silica coated Bi, silica coated Mg, silica coated Sn, or a combination thereof.
3 . The method of claim 2 , wherein the alkali metal-containing film is a lithium metal film.
4 . The method of claim 1 , further comprising:
a release film formed on the carrier substrate, the release film contacting the carrier substrate and the plating and stripping enhancement film.
5 . The method of claim 1 further comprising:
forming an interface film over the carrier substrate; and
forming a solid electrolyte film on the interface film, the interface film and the solid electrolyte film formed prior to the plating and stripping enhancement film.
6 . The method of claim 5 , wherein the interface film, the solid electrolyte film, and the plating and stripping enhancement film are formed using non-vacuum coating techniques.
7 . The method of claim 6 , wherein the alkali metal-containing film is formed using vacuum coating techniques.
8 . The method of claim 1 , wherein the carrier substrate comprises a material selected from polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), metallized plastic, or a combination thereof.
9 . The method of claim 1 , wherein transferring the film stack from the carrier substrate to the flexible conductive substrate comprises a lamination transfer process, a laser lift-off process, or both the lamination transfer process and the laser lift-off process.
10 . The method of claim 5 , wherein the interface films comprises a material selected from lithium fluoride, lithium chloride, lithium iodide, lithium oxide, lithium sulfide, lithium nitride, lithium phosphide, or a combination thereof.
11 . The method of claim 10 , wherein the solid electrolyte film comprises a solid electrolyte selected from lithium super ionic CONductor (LISICON), lithium aluminum germanium phosphate (LAGP), lithium aluminum titanium phosphate (LATP), lithium lanthanum titanium oxide (LLTO), lithium lanthanum zirconium oxide (LLZO), lithium phosphorous oxynitride (LiPON), Li7P2S8I, Li6PS5Cl, Li3PS4 (LPS), Li3.5Ge0.25PS4, Li10GeP2S12 (LGPS), or a combination thereof.
12 . An alkali metal-containing film stack, comprising:
a flexible carrier substrate; and
a film stack formed over the flexible carrier substrate, the film stack comprising:
a plating and stripping enhancement film formed over the flexible carrier substrate, the plating and stripping enhancement film comprising a constriction compliant material; and
an alkali metal-containing film formed on the plating and stripping enhancement film.
13 . The alkali metal-containing film stack of claim 12 , wherein the constriction compliant material is selected from oxides of Mg, oxides of aluminum, oxides of silicon, Ag, Al, Bi, Mg, Zn, Cu, Sn, Si, alloys of Ag, Al, Bi, Mg, Zn, Cu, Sn, Si, silica coated Ag, silica coated Bi, silica coated Mg, silica coated Sn, or a combination thereof.
14 . The alkali metal-containing film stack of claim 13 , wherein the alkali metal-containing film is a lithium metal film.
15 . The alkali metal-containing film stack of claim 13 , further comprising:
a release film formed on the flexible carrier substrate, the release film contacting the flexible carrier substrate and the plating and stripping enhancement film.
16 . The alkali metal-containing film stack of claim 12 , wherein the film stack further comprises
a solid electrolyte film formed over the flexible carrier substrate; and
an interface film formed on the solid electrolyte film, the alkali metal-containing film formed on the interface film.
17 . The alkali metal-containing film stack of claim 16 , wherein the flexible carrier substrate comprises a material selected from polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), metallized plastic, or a combination thereof.
18 . The alkali metal-containing film stack of claim 17 , wherein the interface film comprises a material selected from lithium fluoride, lithium chloride, lithium iodide, lithium oxide, lithium sulfide, lithium nitride, lithium phosphide, or a combination thereof.
19 . The alkali metal-containing film stack of claim 18 , wherein the solid electrolyte comprises a solid electrolyte selected from lithium super ionic CON ductor (LISICON), lithium aluminum germanium phosphate (LA GP), lithium aluminum titanium phosphate (LATP), lithium lanthanum titanium oxide (LLTO), lithium lanthanum zirconium oxide (LLZO), lithium phosphorous oxynitride (LiPON), Li7P2S8I, Li6PS5Cl, Li3PS4 (LPS), Li3.5Ge0.25PS4, Li10GeP2S12 (LGPS), or a combination thereof.
20 . A lamination transfer system, comprising:
a lamination transfer chamber; and
a system controller configured to cause the lamination transfer chamber to perform a process, comprising:
conveying a film stack from a supply hub toward a pickup hub, the film stack comprising a flexible carrier substrate, a plating and stripping enhancement film formed over the flexible carrier substrate, an alkali metal-containing film formed on the plating and stripping enhancement film, wherein the plating and stripping enhancement film comprises a constriction compliant material;
contacting the film stack with a flexible conductive substrate;
laminating the film stack to the flexible conductive substrate; and
removing the flexible carrier substrate from the film stack.