MICRO LED ARRAY AND MICRO LED DISPLAY PANEL
A micro LED array includes a plurality of micro LED structures, wherein each of the micro LED structures includes: a mesa structure; a bonding layer provided at a bottom of the mesa structure to bond the mesa structure with an integrated circuit (IC) backplane; and a first thermal conductive layer formed surrounding sidewalls of the mesa structure and the bonding layer, wherein a material of the first thermal conductive layer is an electrically insulative material with high thermal conductivity.
1 . A micro LED array, comprising a plurality of micro LED structures, each of the micro LED structures comprising:
a mesa structure;
a bonding layer provided at a bottom of the mesa structure to bond the mesa structure with a bottom pad on an integrated circuit (IC) backplane; and
a first thermal conductive layer formed surrounding sidewalls of the mesa structure and the bonding layer, wherein a material of the first thermal conductive layer is an electrically insulative material with high thermal conductivity.
2 . The micro LED array according to claim 1 , wherein a thermal conductivity of the electrically insulative material of the first thermal conductive layer is greater than 300W/mK.
3 . The micro LED array according to claim 2 , wherein the material of the first thermal conductive layer is AlN, SiC, Boron, Nitride, diamond, or diamond-like carbon.
4 . The micro LED array according to claim 1 , further comprising a second thermal conductive layer filled between adjacent ones of micro LED structures, wherein a material of the second thermal conductive layer is a material with high thermal conductivity.
5 . The micro LED array according to claim 4 , wherein a thermal conductivity of the material of the second thermal conductive layer is greater than 300W/mK.
6 . The micro LED array according to claim 5 , wherein the material of the second thermal conductive layer is electrically insulative.
7 . The micro LED array according to claim 6 , wherein the material of the second thermal conductive layer is AlN, SiC, Boron, Nitride, diamond, or diamond-like carbon.
8 . The micro LED array according to claim 5 , wherein the material of the second thermal conductive layer is electrically conductive.
9 . The micro LED array according to claim 8 , wherein the material of the second thermal conductive layer is Ag, Cu, Al, Graphite, or Graphene.
10 . The micro LED array according to claim 1 , further comprising an isolation structure provided between adjacent ones of micro LED structures to isolate light and reduce crosstalk between adjacent ones of micro LED structures.
11 . The micro LED array according to claim 1 , wherein the first thermal conductive layer is further provided on a portion of a top surface of the mesa structure and forms an opening on the top surface of the mesa structure.
12 . The micro LED array according to claim 11 , further comprising a top conductive layer provided in the opening.
13 . The micro LED array according to claim 1 , wherein the first thermal conductive layer is further formed on a top surface of the IC backplane between adjacent ones of micro LED structures.
14 . The micro LED array according to claim 13 , further comprising a top conductive layer provided on a top surface of the mesa structure and on the first thermal conductive layer.
15 . The micro LED array according to claim 1 , further comprising a top conductive layer provided on a top of the micro LED structure, and respective top conductive layers of the plurality of micro LED structure are interconnected.
16 . The micro LED structure according to claim 15 , further comprising a plurality of top contacts provided on the top conductive layer and between adjacent ones of micro LED structures, wherein the plurality of top contacts are interconnected.
17 . A micro LED display panel, comprising:
an integrated circuit (IC) backplane comprising a bottom pad array, the bottom pad array comprising a plurality of bottom pads; and
a micro LED array comprising a plurality of micro LED structures formed on the IC backplane, wherein each of the micro LED structures comprises:
a mesa structure;
a bonding layer provided at a bottom of the mesa structure to bond the mesa structure with a bottom pad on an integrated circuit (IC) backplane; and
a first thermal conductive layer formed surrounding sidewalls of the mesa structure and the bonding layer, wherein a material of the first thermal conductive layer is an electrically insulative material with high thermal conductivity; and
wherein one micro LED structure of the plurality of micro LED structures is electrically connected with one bottom pad of the plurality of bottom pads.