MICRO LED DISPLAY PANEL AND INTEGRATED CIRCUIT BACKPLANE
A micro LED display panel includes an integrated circuit (IC) backplane including a bottom pad array and a micro LED array comprising a plurality of micro LED structures provided on the IC backplane, one micro LED structure of the plurality of micro LED structures being electrically connected with one bottom pad of the plurality of bottom pads. The micro LED structure includes a mesa structure; a first thermal conductive layer formed surrounding a sidewall of the mesa structure, a material of the first thermal conductive layer being an electrically insulative material with high thermal conductivity; and a second thermal conductive layer filled between adjacent ones of micro LED structures. The IC backplane further includes: one or more heat dissipation structures provided corresponding to an area outside the micro LED structure and passing thought the IC backplane to radiate heat to outside, wherein the heat dissipation structure and the bottom pad are separated.
1 . A micro LED display panel, comprising:
an integrated circuit (IC) backplane comprising a bottom pad array, the bottom pad array comprising a plurality of bottom pads; and
a micro LED array comprising a plurality of micro LED structures provided on the IC backplane, one micro LED structure of the plurality of micro LED structures being electrically connected with one bottom pad of the plurality of bottom pads;
each of the micro LED structures comprising:
a mesa structure;
a first thermal conductive layer formed surrounding a sidewall of the mesa structure, a material of the first thermal conductive layer being an electrically insulative material with high thermal conductivity; and
a second thermal conductive layer filled between adjacent ones of micro LED structures, a material of the second thermal conductive layer being a material with high thermal conductivity; and
the IC backplane further comprising:
one or more heat dissipation structures corresponding to an area outside the micro LED structure and passing thought the IC backplane to radiate heat to outside, wherein the heat dissipation structure and the bottom pad are separated.
2 . The micro LED display panel according to claim 1 , wherein the one or more heat dissipation structures are provided corresponding to areas between adjacent ones of micro LED structures.
3 . The micro LED display panel according to claim 1 , wherein a thermal conductivity of the electrically insulative material of the first thermal conductive layer is greater than 300 W/mK.
4 . The micro LED display panel according to claim 3 , wherein the material of the first thermal conductive layer is AlN, SiC, Boron, Nitride, diamond, or diamond-like carbon.
5 . The micro LED display panel according to claim 1 , wherein a thermal conductivity of the material of the second thermal conductive layer is greater than 300 W/mK.
6 . The micro LED display panel according to claim 5 , wherein the material of the second thermal conductive layer is electrically insulative.
7 . The micro LED display panel according to claim 6 , wherein the material of the second thermal conductive layer is AlN, SiC, Boron, Nitride, diamond, or diamond-like carbon.
8 . The micro LED display panel according to claim 5 , wherein the material of the second thermal conductive layer is electrically conductive.
9 . The micro LED display panel according to claim 8 , wherein the material of the second thermal conductive layer is Ag, Cu, Al, Graphite, or Graphene.
10 . The micro LED display panel according to claim 1 , wherein the heat dissipation structure is in contact with the second thermal conductive layer.
11 . The micro LED display panel according to claim 1 , wherein the first thermal conductive layer is further provided on a top surface of the IC backplane between the adjacent ones of micro LED structures, and the heat dissipation structure is in contact with the first thermal conductive layer.
12 . The micro LED display panel according to claim 9 , wherein the micro LED array further comprises a first bonding layer provided at a bottom of the micro LED array; and
the IC backplane comprises a second bonding layer and a substrate layer, the second bonding layer provided at a top of the substrate layer; wherein the first bonding layer and the second bonding layer are bonded.
13 . The micro LED display panel according to claim 12 , wherein a material of the first bonding layer and the second bonding layer is an electrically insulative material with high thermal conductivity.
14 . The micro LED display panel according to claim 13 , wherein a thermal conductivity of the electrically insulative material of the first bonding layer and the second bonding layer is greater than 300 W/mK.
15 . The micro LED display panel according to claim 14 , wherein the electrically insulative material of the first bonding layer and the second bonding layer is AlN, SiC, Boron, Nitride, diamond, or diamond-like carbon.
16 . The micro LED display panel according to claim 13 , wherein the heat dissipation structure passes through the substrate layer in a vertical direction and in contact with the second bonding layer.
17 . The micro LED display panel according to claim 12 , wherein a material of the first bonding layer and the second bonding layer is dielectric.
18 . The micro LED display panel according to claim 17 , wherein the material of the first bonding layer and the second bonding layer is SiO 2 , SiN, or SiCN.
19 . The micro LED display panel according to claim 17 , wherein the heat dissipation structure is a first heat dissipation structure that passes through the second bonding layer and the substrate layer, and the first bonding layer comprises a plurality of second heat dissipation structures corresponding to the plurality of heat dissipation structure.
20 . The micro LED display panel according to claim 1 , wherein a material of the heat dissipation structure is a metal.
21 . The micro LED display panel according to claim 20 , wherein the heat dissipation structure is a Cu pad.
22 . An integrated circuit (IC) backplane, comprising:
a plurality of bottom pads, one bottom pad of the plurality of bottom pads being electrically connected with one micro LED structure of a plurality of micro LED structures; and
one or more heat dissipation structures provided corresponding to an area outside the micro LED structure and passing thought the IC backplane to radiate heat to outside, wherein the heat dissipation structure and the bottom pad are separated.
23 . The IC backplane according to claim 22 , wherein the one or more heat dissipation structures are provided corresponding to areas between adjacent ones of micro LED structures.
24 . The IC backplane according to claim 22 , comprising a bonding layer and a substrate layer, the bonding layer being provided on the substrate layer.
25 . The IC backplane according to claim 24 , wherein a material of the bonding layer is an electrically insulative material with high thermal conductivity, and the heat dissipation structure passes through the substrate layer and in contact with the bonding layer.
26 . The IC backplane according to claim 24 , wherein a material of the bonding layer is dielectric, and the heat dissipation structure passes through the bonding layer and the substrate layer.