MICRO LED DISPLAY PANEL
A micro LED display panel includes an integrated circuit (IC) backplane; a micro LED array provided on the IC backplane, the IC backplane controlling the micro LED array; and a heat dissipation structure provided on the IC backplane and in contact with edges of the micro LED array.
1 . A micro LED display panel, comprising:
an integrated circuit (IC) backplane;
a micro LED array provided on the IC backplane, the IC backplane controlling the micro LED array; and
a heat dissipation structure provided on the IC backplane and in contact with edges of the micro LED array.
2 . The micro LED display panel according to claim 1 , wherein the heat dissipation structure is provided surrounding the micro LED array.
3 . The micro LED display panel according to claim 1 , wherein the heat dissipation structure further comprises one or more hollow columns passing through the heat dissipation structure in a vertical direction perpendicular to the IC backplane.
4 . The micro LED display panel according to claim 1 , wherein the heat dissipation structure further comprises one or more grooves on a surface of the heat dissipation structure.
5 . The micro LED display panel according to claim 4 , wherein the one or more grooves are one or more holes.
6 . The micro LED display panel according to claim 1 , further comprising a cooling plate provided at a bottom of the IC backplane.
7 . The micro LED display panel according to claim 6 , wherein the heat dissipation structure further comprises one or more enhanced dissipation structures formed on a sidewall of the heat dissipation structure.
8 . The micro LED display panel according to claim 7 , wherein each of the enhanced dissipation structures is further in contact with the cooling plate.
9 . The micro LED display panel according to claim 7 , wherein each of the one or more enhanced dissipation structures is further formed on a portion of a top surface of the heat dissipation structure.
10 . The micro LED display panel according to claim 7 , wherein the one or more enhanced dissipation structures are made of a thermal conductive material.
11 . The micro LED display panel according to claim 10 , wherein the one or more enhanced dissipation structures comprise wires or thermal conductive adhesives.
12 . The micro LED display panel according to claim 6 , wherein a material of the cooling plate is a thermal conductive material.
13 . The micro LED display panel according to claim 12 , wherein the material of the cooling plate is Cu, Al2O3, AlN, SiC, Al, or 4J36 (INVAR).
14 . The micro LED display panel according to claim 1 , wherein a material of the heat dissipation structure is Cu, AlN, SiC, Boron Nitride, diamond or diamond-like carbon, Al, or 4J36 (INVAR).
15 . The micro LED display panel according to claim 14 , wherein a thickness of the heat dissipation structure is in a range of 1 μm to 1 mm.
16 . The micro LED display panel according to claim 1 , further comprising a cover plate provided above the micro LED array and supported by the heat dissipation structure.
17 . The micro LED display panel according to claim 1 , further comprising a plurality of input/output (I/O) pads provided at edges of the IC backplane.