IP Library Patent Application 19210075
Patent Application
App. No. 19/210,075

HIGH IMPACT SOLDER TOUGHNESS ALLOY

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Quick Facts
Patent No.
US None
App. No.
19/210,075
Abstract

A lead-free solder alloy comprising from 35 to 59 wt % Bi; from 0 to 1.0 wt % Ag; from 0.05 to 0.4 wt % Cu; from 0 to 0.5 wt % Co; and the balance Sn, together with any unavoidable impurities.

Claims (54)

1 . A lead-free solder alloy, comprising:

from 35 to 59 wt % Bi;

from 0.9 to 1.0 wt % Ag;

from 0.1 to 1.0 wt % Cu;

from 0.01 to 0.07 wt % Co;

and the balance Sn, together with any unavoidable impurities;

wherein the alloy begins to melt at approximately 138° C.

2 . (canceled)

3 . (canceled)

4 . The alloy of claim 1 consisting of:

from 35 to 59 wt % Bi;

from 0.9 to 1.0 wt % Ag;

from 0.1 to 1.0 wt % Cu;

from 0.01 to 0.07 wt % Co;

and the balance Sn, together with any unavoidable impurities;

wherein the alloy begins to melt at approximately 138° C.

5 . The alloy as claimed in claim 4 wherein the Co is present in a concentration between 0.02 and 0.04 wt %.

6 . (canceled)

7 . (canceled)

8 . The alloy as claimed in claim 4 wherein the Co is present in a concentration of 0.03 wt %.

9 . (canceled)

10 . (canceled)

11 . (canceled)

12 . The alloy as claimed in claim 1 further comprising from 0.001 to 1.0 wt % Ge.

13 . The alloy as claimed in claim 1 further comprising from 0.001 to 0.1 wt % Ge.

14 . The alloy as claimed in claim 1 further comprising from 0.001 to 0.01 wt % Ge.

15 . The alloy as claimed in claim 1 consisting of:

from 35 to 59 wt % Bi;

from 0.9 to 1.0 wt % Ag;

from 0.1 to 1.0 wt % Cu;

from 0.01 to 0.07 wt % Co;

from 0.001 to 1.0 wt % Ge; and

the balance Sn together with any unavoidable impurities;

wherein the alloy begins to melt at approximately 138° C.

16 . The alloy as claimed in claim 15 wherein the Bi is present in a concentration between 45 and 50 wt %.

17 . (canceled)

18 . The alloy as claimed in claim 15 wherein the Cu concentration is 1 wt %.

19 . The alloy as claimed in claim 1 wherein the Bi is present in a concentration between 45 and 50 wt %.

20 . (canceled)

21 . The alloy as claimed in claim 1 wherein the Cu concentration is 1 wt %.

22 . The alloy as claimed in claim 1 further comprising from 0.001 to 1.0 wt % Sb.

23 . The alloy as claimed in claim 1 further comprising from 0.003 to 0.7 wt % Sb.

24 . The alloy as claimed in claim 1 further comprising from 0.005 to 0.05 wt % Sb.

25 . The alloy as claimed in claim 1 consisting of:

from 35 to 59 wt % Bi;

from 0.9 to 1.0 wt % Ag;

from 0.1 to 1.0 wt % Cu;

from 0.01 to 0.07 wt % Co;

from 0.001 to 1.0 wt % Sb; and

the balance Sn together with any unavoidable impurities;

wherein the alloy begins to melt at approximately 138° C.

26 . The alloy as claimed in claim 1 , wherein the Bi is present in a concentration between 35 and 50 wt %.

27 . The alloy as claimed in claim 15 , wherein the Bi is present in a concentration between 35 and 50 wt %.

28 . The alloy as claimed in claim 25 , wherein the Bi is present in a concentration between 35 and 50 wt %.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2025
From: PANDHER, RANJIT; SINGH, BAWA; SARKAR, SIULI; CHEGUDI, SUJATHA; KUMAR, ANIL K.N.; CHATTOPADHYAY, KAMANIO; LODGE, DOMINIC; RIBAS, MORGANA DE AVILA
To: ALPHA METALS, INC.
Reel/Frame 072348/0309 →
CHANGE OF NAME Recorded Sep 23, 2025
From: ALPHA METALS, INC.
To: ALPHA ASSEMBLY SOLUTIONS INC.
Reel/Frame 072954/0084 →