MICRO LED ELEMENT, MICRO LED DISPLAY PANEL AND DISPLAY DEVICE
A micro LED element, a micro LED display panel, and a display device are provided. The micro LED element includes: a first semiconductor layer, a light emitting layer, and a second semiconductor layer stacked from top down; and a metal contact including a plurality of metal particles conductively coupled to the top surface of the first semiconductor layer.
1 . A micro LED element, comprising:
a first semiconductor layer, a light emitting layer, and a second semiconductor layer stacked from top down; and
a metal contact comprising a plurality of metal particles conductively coupled to the top surface of the first semiconductor layer.
2 . The micro LED element according to claim 1 , wherein a thickness of the metal contact is less than 100 nm.
3 . The micro LED element according to claim 1 , wherein a size of each of the plurality of metal particles is less than 500 nm.
4 . The micro LED element according to claim 1 , further comprising:
a transparent conductive layer formed on a top surface of the first semiconductor layer, wherein the metal contact is embedded in the transparent conductive layer; and
a contact pad conductively coupled to the second semiconductor layer.
5 . The micro LED element according to claim 4 , wherein a distribution diameter of the plurality of metal particles in the transparent conductive layer is within a range from 700 nm to 800 nm.
6 . The micro LED element according to claim 4 , wherein a distribution density of the plurality of metal particles in the transparent conductive layer is within a range from 10/μm 2 to 10000/μm 2 .
7 . The micro LED element according to claim 4 , wherein the first semiconductor layer, the light emitting layer, and the second semiconductor layer are stacked as a mesa; and the micro LED element further comprises:
a passivation layer formed on a sidewall surface of the mesa.
8 . The micro LED element according to claim 7 , wherein the passivation layer is an ALD (Atomic Layer Deposition)-based layer.
9 . The micro LED element according to claim 7 , wherein a diameter of a top surface of the mesa is smaller than a diameter of a bottom surface of the mesa.
10 . The micro LED element according to claim 7 , wherein the transparent conductive layer is further formed on a surface of the passivation layer.
11 . The micro LED element according to claim 7 , wherein the mesa further comprises: a second transparent conductive layer formed on a bottom surface of the second semiconductor layer, wherein the contact pad is formed on a bottom surface of the second transparent conductive layer.
12 . The micro LED element according to claim 4 , further comprising:
a first passivation layer formed on a first sidewall surface of the first semiconductor layer; and
a second passivation layer formed on a second sidewall surface of the second semiconductor layer.
13 . The micro LED element according to claim 12 , wherein at least one of the first passivation layer and the second passivation layer is an ALD-based layer.
14 . The micro LED element according to claim 12 , further comprising: a second transparent conductive layer formed on a bottom surface of the second semiconductor layer, wherein the contact pad is formed below the second transparent conductive layer.
15 . The micro LED element according to claim 14 , further comprising: a metal reflective layer formed on a bottom surface of the second transparent conductive layer, wherein the contact pad is formed on a bottom surface of the metal reflective layer.
16 . The micro LED element according to claim 15 , wherein the metal reflective layer is further formed on a surface of the second passivation layer.
17 . The micro LED element according to claim 12 , further comprising: a second metal contact embedded in the transparent conductive layer, the second metal contact comprising a plurality of metal particles formed on a top surface of the first passivation layer.
18 . A micro LED display panel, comprising:
an integrated circuit (IC) backplane comprising a common pad and a plurality of bottom contacts; and
a plurality of micro LED elements each according to claim 1 disposed on a top surface of the IC backplane, and wherein:
a transparent conductive layer of each of the plurality of micro LED elements is conductively coupled to the common pad; and
a contact pad of each of the plurality of micro LED elements is formed to contact a corresponding bottom contact of the plurality of bottom contacts.
19 . A display device, comprising a micro LED element, wherein the micro LED element comprises:
a first semiconductor layer, a light emitting layer, and a second semiconductor layer stacked from top down; and
a metal contact comprising a plurality of metal particles conductively coupled to the top surface of the first semiconductor layer.