MICRO LED DISPLAY PANEL AND DISPLAY DEVICE
A micro LED display panel and a display device are provided. The micro LED display panel includes: a plurality of micro LED elements each including a first semiconductor layer, a light emitting layer, and a second semiconductor layer stacked from top down; and a plurality of contact pads each arranged between adjacent micro LED elements of a part of the plurality of micro LED elements and conductively coupled to the respective first semiconductor layers of the adjacent micro LED elements.
1 . A micro LED display panel, comprising:
a plurality of micro LED elements each comprising a first semiconductor layer, a light emitting layer, and a second semiconductor layer stacked from top down; and
a plurality of contact pads each arranged between adjacent micro LED elements of a part of the plurality of micro LED elements and conductively coupled to the respective first semiconductor layers of the adjacent micro LED elements.
2 . The micro LED display panel according to claim 1 , wherein the part of the plurality of micro LED elements is selected, by a decimation rule, from the plurality of micro LED elements.
3 . The micro LED display panel according to claim 2 , wherein the plurality of micro LED elements are arranged in an array with rows and columns, and the part of the plurality of micro LED elements comprises target rows of micro LED elements or target columns of micro LED elements of the plurality of micro LED elements.
4 . The micro LED display panel according to claim 3 , wherein at least a part of the plurality of contact pads are connected to each other to form a linear conductor.
5 . The micro LED display panel according to claim 2 , wherein the plurality of micro LED elements are arranged in an array with rows and columns, and the part of the plurality of micro LED elements comprise groups of four adjacent micro LED elements, each group forming a square; and
wherein at least a part of the plurality of contact pads are arranged at a center of the four adjacent micro LED elements.
6 . The micro LED display panel according to claim 1 , wherein the plurality of contact pads are arranged on the respective first semiconductor layers of the adjacent micro LED elements.
7 . The micro LED display panel according to claim 1 , wherein the first semiconductor layer, the light emitting layer, and the second semiconductor layer are stacked as a mesa; and each of the plurality of micro LED elements further comprises:
a passivation layer formed on a sidewall surface of the mesa and extending to contact the passivation layer of an adjacent micro LED element; and
a transparent conductive layer formed on a top surface of the first semiconductor layer and a top surface of the passivation layer and connected to the transparent conductive layer of an adjacent micro LED element, wherein the plurality of contact pads are arranged on the transparent conductive layers of the adjacent micro LED elements.
8 . The micro LED display panel according to claim 1 , wherein the first semiconductor layer, the light emitting layer, and the second semiconductor layer are stacked as a mesa; and each of the plurality of micro LED elements further comprises:
a passivation layer formed on a sidewall surface of the mesa and extending to contact the passivation layer of an adjacent micro LED element, wherein the plurality of contact pads are embedded in the passivation layers of the adjacent micro LED elements.
9 . The micro LED display panel according to claim 8 , wherein a top surface of each of the plurality of contact pads is aligned with a top surface of the passivation layer.
10 . The micro LED display panel according to claim 8 , wherein the passivation layer is an ALD (Atomic Layer Deposition)-based layer.
11 . The micro LED display panel according to claim 7 , wherein the transparent conductive layer is a first transparent conductive layer, the mesa further comprising: a second transparent conductive layer formed on a bottom surface of the second semiconductor layer.
12 . The micro LED display panel according to claim 11 , wherein each of the plurality of micro LED elements further comprises:
a metal reflective layer formed on a bottom surface of the second transparent conductive layer; and
a connecting layer formed on a bottom surface of the metal reflective layer and conductively coupled to the second semiconductor layer.
13 . The micro LED display panel according to claim 1 , wherein each of the plurality of micro LED elements further comprises:
a transparent conductive layer formed on a top surface of the first semiconductor layer, wherein the plurality of contact pads are embedded in the transparent conductive layers of the adjacent micro LED elements.
14 . The micro LED display panel according to claim 13 , wherein each of the plurality of micro LED elements further comprises:
a first passivation layer formed on an edge of an upper portion of the first semiconductor layer; and
a second passivation layer formed on a bottom surface of the second semiconductor layer;
wherein the light emitting layers of the plurality of micro LED elements together form a continuous layer, and the plurality of contact pads are formed on the first passivation layers of the adjacent micro LED elements.
15 . The micro LED display panel according to claim 14 , wherein at least one of the first passivation layer and the second passivation layer is an ALD-based layer.
16 . The micro LED display panel according to claim 14 , wherein the transparent conductive layer is a first transparent conductive layer, and each of the plurality of micro LED elements comprises:
a second transparent conductive layer formed on a bottom surface of the second semiconductor layer; and
a connecting pad formed below the second transparent conductive layer and conductively coupled to the second semiconductor layer.
17 . The micro LED display panel according to claim 16 , wherein each of the plurality of micro LED elements comprises: a metal reflective layer formed on a bottom surface of the second transparent conductive layer, wherein the connecting pad is formed on a bottom surface of the metal reflective layer.
18 . The micro LED display panel according to claim 17 , wherein the metal reflective layer is further formed on a surface of the second passivation layer, the second passivation layer being provided between the metal reflective layer and the second semiconductor layer.
19 . The micro LED display panel according to claim 14 , wherein the plurality of micro LED elements each comprises a metal contact arranged on the first semiconductor layer.
20 . The micro LED display panel according to claim 1 , further comprising:
an integrated circuit (IC) backplane comprising a common pad and a plurality of bottom contacts providing a driving signal generated by the IC backplane; and
wherein the plurality of micro LED elements are disposed on a top surface of the IC backplane, the first semiconductor layers of the plurality of micro LED elements are conductively coupled to the common pad, and the second semiconductor layers of the plurality of micro LED elements are conductively coupled to a corresponding bottom contact of the plurality of bottom contacts.
21 . A display device, comprising a micro LED display panel, wherein the micro LED display panel comprises:
a plurality of micro LED elements each comprising a first semiconductor layer, a light emitting layer, and a second semiconductor layer stacked from top down; and
a plurality of contact pads each arranged between adjacent micro LED elements of a part of the plurality of micro LED elements and conductively coupled to the respective first semiconductor layers of the adjacent micro LED elements.