LOW-RESIDUE HIGH TEMPERATURE-RESISTANT DRY ADHESIVE AND METHODS OF USE
A dry adhesive microfiber array comprising a plurality of fibers with tips adapted to contact a surface, where the dry adhesive is capable of adhering to the surface at elevated temperatures. The bonding strength of the dry adhesive remains constant or increases with increasing substrate/dry adhesive/carrier temperature. The dry adhesive can be debonded without leaving a residue on the surface of the substrate. In addition, the effect of temperature on bonding strength of the dry adhesive is reversible.
1 . A dry adhesive comprising:
a plurality of fibers comprising a stem and a tip disposed on a distal end of the fiber;
a backing layer, wherein a proximate end of the fiber is attached to a first surface of the backing layer,
wherein the dry adhesive maintains adhesion across a range of temperatures.
2 . The dry adhesive of claim 1 , wherein the range of temperatures includes temperatures above 230° C.
3 . The dry adhesive of claim 1 , wherein the plurality of fibers comprises a silicone rubber.
4 . The dry adhesive of claim 1 , further comprising:
additional fibers disposed on a second surface of the backing layer, wherein the second surface is opposite to the first surface.
5 . The dry adhesive of claim 1 , wherein the stems comprise a first polymer and the tips comprise a second polymer.
6 . The dry adhesive of claim 5 , wherein the first polymer comprises a high temperature silicone.
7 . A method of adhering a device to a carrier comprising:
providing a dry adhesive comprising a plurality of fibers comprising a stem and a tip, wherein the tip is disposed on a distal end of the fiber;
contacting the dry adhesive to a device; and
subjecting the device and dry adhesive to a maximum temperature of at least 225° C.,
wherein a force of adhesion between the dry adhesive and the device remains constant or increases when subjected to the maximum temperature.
8 . The method of claim 7 , further comprising:
cooling the device and dry adhesive to a temperature below the maximum temperature; and
removing the dry adhesive from the device.
9 . The method of claim 7 , wherein the device comprises a silicon wafer, a silicon carbide wafer, a semiconductor device, glass, or a computer processor.
10 . The method of claim 7 , wherein the dry adhesive and device are subjected to the maximum temperature for a period of time of at least 1 minute.
11 . The method of claim 7 , wherein the dry adhesive and device are subjected to the maximum temperature for a period of time of at least 60 minutes.
12 . The method of claim 7 , further comprising cycling the temperature between a minimum temperature and the maximum temperature.
13 . The method of claim 7 , wherein the force of adhesion is at least 5 N/cm2 at a temperature of 250° C.
14 . A method of adhering a hydrophilic material to a substrate comprising:
providing a dry adhesive on a surface of the substrate, the dry adhesive comprising:
a plurality of fibers comprising a stem and a tip disposed on a distal end of the fiber; and
a backing layer, wherein a proximate end of the fiber is attached to a first surface of the backing layer;
affixing the hydrophilic material to the dry adhesive at a first temperature; and
heating the dry adhesive to a second temperature.
15 . The method of claim 14 , wherein the second temperature is at least 230 degrees Celsius.
16 . The method of claim 14 , further comprising:
cooling the dry adhesive to a temperature below the second temperature; and
removing the hydrophilic material from the dry adhesive.
17 . The method of claim 14 , wherein a hydroxyl group is present on the tip at the second temperature.