IP Library Patent Application 19251108
Patent Application
App. No. 19/251,108

METHOD OF PROVIDING AN ELECTRICALLY CONDUCTIVE LAYER TO A PLASTIC HOUSING BY INSERTION MOLDING OF A CONDUCTIVE FILM

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Quick Facts
Patent No.
US None
App. No.
19/251,108
Abstract

A method of providing an electrically conductive layer to a plastic splice housing for electromagnetically shielded cable harnesses includes providing an electrically conductive film and a mold, inserting the film into the mold, and injecting plastic into the mold so that the plastic bonds with the electrically conductive film, thereby forming an integrated conductive layer on the plastic housing suitable for electromagnetic shielding.

Claims (26)

1 . A method of providing an electrically conductive layer to a plastic housing, in particular a splice housing for electromagnetically shielded cable harnesses, the method comprising the steps of:

a) providing an electrically conductive film and a mold;

b) inserting the film into the mold; and

c) injecting plastic into the mold so that the plastic bonds with the electrically conductive film.

2 . The method according to claim 1 , wherein the mold has a 3D-contour and wherein the film conforms to the 3D-contour during step c) due to the injected plastic.

3 . The method according to claim 2 , wherein the film is pre-formed to at least partially conform to the 3D-contour of the mold prior to step b).

4 . The method according to claim 2 , wherein after step c) the film completely covers the 3D-contour of the mold.

5 . The method according to claim 2 , wherein the film after step c) does not completely cover the 3D-contour of the mold.

6 . The method according to claim 1 , wherein the film is an in-mold label.

7 . The method according to claim 1 , wherein the film comprises aluminum.

8 . The method according to claim 1 , wherein the film has a thickness in a range of 0.1 mm to 5 mm.

9 . The method according to claim 1 , wherein a ratio of a thickness of the plastic to a thickness of the electrically conductive film is in a range 1:1 to 10:1 after step c).

10 . The method according to claim 9 , wherein the ratio of the thickness of the plastic to the thickness of the electrically conductive film is in a range 3:1 to 7:1 after step c).

11 . The method according to claim 10 , wherein the ratio of the thickness of the plastic to the thickness of the electrically conductive film is 5:1 after step c).

12 . The method according to claim 1 , wherein the film comprises fixation means configured to form a form fit connection with the plastic.

13 . The method according to claim 12 , wherein the fixation means comprises teeth.

14 . The method according to claim 1 , wherein the film comprises a perforation.

15 . A splice housing for electromagnetically shielded cable harnesses, comprising two halves formed by a method comprising:

a) providing an electrically conductive film and a mold;

b) inserting the film into the mold; and

c) injecting plastic into the mold so that the plastic bonds with the electrically conductive film.

16 . A cable harness, comprising a splice housing according to claim 15 .

17 . A vehicle comprising a cable harness according to claim 16 .

18 . A splice housing for an electromagnetically shielded cable harnesses, comprising:

an outer housing made from injection molded plastic; and

an interior conductive film, bonded to interior walls of the outer housing by an injection molding process.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 14, 2026
From: APTIV TECHNOLOGIES AG
To: APTIV MANUFACTURING MANAGEMENT SERVICES GMBH
Reel/Frame 074656/0563 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2025
From: CIESZYNSKI, MICHAL; KWIATKOWSKI, PAWEL
To: APTIV TECHNOLOGIES AG
Reel/Frame 072371/0259 →