METHOD OF MONITORING A SURFACE CONDITION OF A COMPONENT
A system for monitoring a surface condition of a component includes a controller including one or more processors configured to execute instructions stored in a nontransitory computer-readable medium. The instructions include controlling a heater to provide thermal energy to the component, determining a thermal response of the component based on the thermal energy, determining a thermal characteristic of the component based on a reference thermal response and the thermal response, and predicting the surface condition of the component based on the thermal characteristic and a predictive analytic model, where the predictive analytic model correlates the thermal characteristic of the component to an estimated surface condition of the component.
1 . A system for monitoring a surface condition of a component, the system comprising:
a controller comprising one or more processors configured to execute instructions stored in a nontransitory computer-readable medium, wherein the instructions comprise:
controlling a heater to provide thermal energy to the component;
determining a thermal response of the component based on the thermal energy;
determining a thermal characteristic of the component based on a reference thermal response and the thermal response; and
predicting the surface condition of the component based on the thermal characteristic and a predictive analytic model, wherein the predictive analytic model correlates the thermal characteristic of the component to an estimated surface condition of the component.
2 . The system according to claim 1 , wherein the thermal characteristic is based on a difference between the reference thermal response and the thermal response.
3 . The system according to claim 1 , wherein the thermal characteristic is an emissivity of the component, a thermal coupling among different zones of the component, a thermal gain of the component, an electric resistance-temperature correlation of the component, a gas convective coupling of the component, or a combination thereof.
4 . The system according to claim 1 , wherein controlling the heater to provide the thermal energy to the component further comprises increasing thermal energy provided to the component.
5 . The system according to claim 1 , wherein controlling the heater to provide the thermal energy to the component further comprises decreasing thermal energy provided to the component.
6 . The system according to claim 1 , wherein the surface condition indicates an amount of material buildup on a surface of the component.
7 . The system according to claim 1 , wherein the thermal response includes a rate of dissipation of thermal energy by the component.
8 . The system according to claim 1 , wherein controlling the heater to provide the thermal energy to the component further comprises varying at least one of an intensity and a duration of the thermal energy to create a thermal signature of the component, wherein the thermal signature is an image representation of the thermal response.
9 . The system according to claim 8 , wherein the instructions further comprise determining the thermal characteristic of the component based on a reference thermal signature and the thermal signature.
10 . The system according to claim 1 , wherein the component is selected from a group consisting of a wall of a semiconductor processing chamber, a liner of the semiconductor processing chamber, a showerhead of the semiconductor processing chamber, a lid of the semiconductor processing chamber, a wall of a fluid heating conduit, a heater surface, and a sheath of the heater.
11 . The system according to claim 1 , wherein the instructions further comprise measuring a temperature of the component during a predetermined period to determine the thermal response.
12 . The system according to claim 11 , wherein the instructions further comprise determining a dissipation of energy by the component based on a change in the temperature of the component during the predetermined period.
13 . The system according to claim 12 , wherein the instructions further comprise determining a change in emissivity of the component based on the change in the temperature of the component during the predetermined period.
14 . The system according to claim 1 , wherein the thermal response of the component is determined in response to a temperature of the component being equal to a predetermined temperature.
15 . A system for monitoring a surface condition of a component, the system comprising:
a thermal control system comprising a heater, wherein the heater is configured to provide thermal energy to the component, and wherein the component is selected from a group consisting of a wall of a semiconductor processing chamber, a liner of the semiconductor processing chamber, a showerhead of the semiconductor processing chamber, a lid of the semiconductor processing chamber, a wall of a fluid heating conduit, a heater surface, and a sheath of the heater; and
a controller comprising one or more processors configured to execute instructions stored in a nontransitory computer-readable medium, wherein the instructions comprise:
controlling the heater to provide thermal energy to the component;
determining a thermal response of the component based on the thermal energy;
determining a thermal characteristic of the component based on a reference thermal response and the thermal response; and
predicting the surface condition of the component based on the thermal characteristic and a predictive analytic model, wherein the predictive analytic model correlates the thermal characteristic of the component to an estimated surface condition of the component.
16 . The system according to claim 15 , wherein the thermal characteristic is an emissivity of the component, a thermal coupling among different zones of the component, a thermal gain of the component, an electric resistance-temperature correlation of the component, a gas convective coupling of the component, or a combination thereof.
17 . The system according to claim 15 , wherein the surface condition indicates an amount of material buildup on a surface of the component.
18 . The system according to claim 15 , wherein the instructions further comprise measuring a temperature of the component during a predetermined period to determine the thermal response.
19 . The system according to claim 15 , wherein the thermal characteristic is based on a difference between the reference thermal response and the thermal response.
20 . A method for monitoring a surface condition of a component, the method comprising:
controlling, by a controller, a heater to provide thermal energy to the component, wherein the controller comprises one or more processors configured to execute instructions stored in a nontransitory computer-readable medium;
determining, by the controller, a thermal response of the component based on the thermal energy;
determining, by the controller, a thermal characteristic of the component based on a reference thermal response and the thermal response; and
predicting, by the controller, the surface condition of the component based on the thermal characteristic and a predictive analytic model, wherein the predictive analytic model correlates the thermal characteristic of the component to an estimated surface condition of the component.