IP Library › Patent Application 19264664
Patent Application
App. No. 19/264,664

Roll-To-Roll Additive Manufacturing Method and Device

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Quick Facts
Patent No.
US None
App. No.
19/264,664
Abstract

A flexible laminate electronic device includes a flexible substrate that includes electrical connections between electronic components attached to the flexible substrate. A first flexible additive layer includes apertures, wherein at least one of the one or more electronic components is aligned in one of the apertures. A subsequent flexible additive layer is disposed over the first flexible additive layer and aligned around respective portions of the electronic components protruding above the first flexible additive layer. A flexible cover layer is placed over the subsequent flexible additive layer.

Claims (23)

1 . A method comprising:

dispensing a flexible substrate from a roll;

placing a plurality of electronic components on a dispensed portion of the flexible substrate;

receiving a set of profile heights of the plurality of electronic components:

determining a set of additive layer thicknesses based on the set of profile heights, the set of additive layer thicknesses including a first thickness and a subsequent thickness;

dispensing a first additive layer from a roll, the first additive layer having a thickness corresponding to the first thickness and comprising at least a first set of apertures;

positioning the first additive layer on the flexible substrate, wherein each of the plurality of electronic components are aligned in a respective aperture of the first set of apertures;

dispensing a second additive layer from a roll, the second additive layer having a thickness corresponding to the subsequent thickness and comprising at least a second set of apertures;

positioning the second additive layer over the first flexible additive layer, aligning the second set of apertures around respective portions of one or more of the plurality of electronic components protruding above the first flexible additive layer; and

emplacing a flexible cover layer over the second flexible additive layer.

2 . The method of claim 1 , further comprising:

applying a compressive force to the flexible substrate and the flexible cover layer using a pair of laminating rollers.

3 . The method of claim 1 , wherein a first electronic device comprises a portion of the flexible substrate, the plurality of electronic components, the first additive layer, the second additive layer, and the flexible cover layer.

4 . The method of claim 3 , further comprising:

taking up the flexible substrate, the plurality of electronic components, the first additive layer, the second additive layer, and the flexible cover layer on a take-up roll, wherein the take-up roll comprises a plurality of electronic devices including the first electronic device.

5 . The method of claim 1 , wherein the substrate comprises an adhesive layer on a bottom surface of the flexible substrate.

6 . The method of claim 4 , wherein the first electronic device is configured to be activated, in response to being cut or to being separated from the take-up roll.

7 . A method comprising:

receiving a set of profile heights of a plurality of electronic components;

determining a set of additive layer thicknesses based on the set of profile heights, the set of additive layer thicknesses including a first thickness and a subsequent thickness;

selecting a first additive layer having the first thickness;

selecting a second additive layer having the subsequent thickness; and

assembling a flexible electronic device comprising the plurality of electronic devices, the first additive layer, and the second additive layer.