OPTICAL ASSEMBLY WITH A MICROLENS COMPONENT AND CONTACTS ON A SAME SURFACE OF A VERTICAL CAVITY SURFACE EMITTING LASER DEVICE
In some implementations, an optical assembly includes a substrate that includes a thermally conductive core, an IC driver chip that is disposed on a first surface of the substrate, and a VCSEL device that includes an electrically insulated surface that is disposed on the thermally conductive core of the substrate within a cavity formed in the second surface of the substrate. The VCSEL device includes a cathode contact disposed on a surface of the VCSEL device and an anode contact disposed on the surface of the VCSEL device. The VCSEL device includes a plurality of emitters and a microlens component that is disposed over the plurality of emitters on the surface of the VCSEL device.
1 . An optical assembly, comprising:
a substrate;
an integrated circuit (IC) driver chip that is disposed on a first surface of the substrate;
an electrical element that is disposed on a second surface of the substrate; and
a vertical cavity surface emitting laser (VCSEL) device that is disposed on the second surface, wherein:
the first surface is opposite the second surface, and
at least a portion of the IC driver chip and at least a portion of the VCSEL device are vertically aligned on a same portion of the substrate.
2 . The optical assembly of claim 1 , wherein the electrical element comprises a photodiode.
3 . The optical assembly of claim 1 , further comprising a housing and an optical element.
4 . The optical assembly of claim 3 , wherein the optical element is held by at least one support component of the housing via an attachment material.
5 . The optical assembly of claim 3 , wherein the optical element comprises a diffractive optical element or a diffuser.
6 . The optical assembly of claim 1 , wherein the electrical element is electrically or mechanically connected to the second surface of the substrate via an attachment material.
7 . The optical assembly of claim 1 , wherein the electrical element comprises a capacitor.
8 . The optical assembly of claim 7 , wherein the capacitor is an equivalent series inductance capacitor.
9 . The optical assembly of claim 1 , wherein the VCSEL device comprises:
a substructure,
a plurality of emitters disposed within the substructure of the VCSEL device,
a microlens component disposed over the plurality of emitters and on a top surface of the substructure of the VCSEL device,
a cathode contact disposed on the top surface of the substructure of the VCSEL device, and
an anode contact disposed on the top surface of the substructure of the VCSEL device.
10 . The optical assembly of claim 1 , wherein the VCSEL device comprises:
a short-wave infrared (SWIR) VCSEL device;
an oxide confined VCSEL device;
an implant confined VCSEL device;
a mesa confined VCSEL device; or
a top emitting VCSEL device.
11 . An optical assembly, comprising:
a substrate that includes a thermally conductive core;
an integrated circuit (IC) driver chip that is disposed on a first surface of the substrate;
an electrical element that is disposed on a second surface of the substrate; and
a vertical cavity surface emitting laser (VCSEL) device that is disposed on the second surface,
wherein the first surface is opposite the second surface.
12 . The optical assembly of claim 11 , wherein the electrical element comprises a photodiode.
13 . The optical assembly of claim 11 , further comprising a housing and an optical element.
14 . The optical assembly of claim 13 , wherein the optical element is held by at least one support component of the housing via an attachment material.
15 . The optical assembly of claim 13 , wherein the optical element comprises a diffractive optical element or a diffuser.
16 . The optical assembly of claim 11 , wherein the electrical element is electrically or mechanically connected to the second surface of the substrate via an attachment material.
17 . The optical assembly of claim 11 , wherein the electrical element comprises a capacitor.
18 . The optical assembly of claim 17 , wherein the capacitor is an equivalent series inductance capacitor.
19 . The optical assembly of claim 11 , wherein the VCSEL device includes:
a cathode contact disposed on a surface of the VCSEL device, and
an anode contact disposed on the surface of the VCSEL device.
20 . An optical assembly, comprising:
a substrate that includes a thermally conductive core;
an integrated circuit (IC) driver chip that is disposed on a first surface of the substrate;
an electrical element that is disposed on a second surface of the substrate; and
a vertical cavity surface emitting laser (VCSEL) device that includes an electrically insulated surface that is disposed on the thermally conductive core of the substrate within a cavity formed in the second surface,
wherein the first surface is opposite the second surface.