SCAN NEEDLE AND SCAN DISPLAY SYSTEM INCLUDING SAME
A micro-light emitting diode (LED) structure includes a substrate and at least one micro-LED formed above the substrate. The at least one micro-LED includes a metal layer formed above the substrate, a light emitting layer formed above the metal layer, an insulating layer covering the micro-LED and including an opening exposing a portion of the light emitting layer, and a transparent conductive layer above the insulating layer and electrically connected to the light emitting layer via the opening of the insulating layer.
1 . A micro-light emitting diode (LED) structure, comprising:
a substrate; and
at least one micro-LED formed above the substrate, wherein the at least one micro-LED comprises:
a metal layer formed above the substrate;
a light emitting layer formed above the metal layer;
an insulating layer covering the micro-LED and including an opening exposing a portion of the light emitting layer; and
a transparent conductive layer above the insulating layer and electrically connected to the light emitting layer via the opening of the insulating layer.
2 . The micro-LED structure of claim 1 , further comprising:
a micro-lens formed above the micro-LED.
3 . The micro-LED structure of claim 2 , wherein the micro-lens is vertically aligned with the micro LED.
4 . The micro-LED structure of claim 2 , comprising:
a plurality of the micro-LEDs;
a plurality of the micro-lenses; and
a transparent isolation layer above the plurality of micro-LEDs, and formed between the plurality of micro-lenses and the plurality of micro-LEDs.-LEDs.
5 . The micro-LED structure of claim 4 , wherein the transparent isolation layer includes an exposed surface formed between adjacent micro-lenses and not covered by the plurality of micro-lenses.
6 . The micro-LED structure of claim 1 , wherein a profile of the light emitting layer vertically projected on a top surface of the substrate is surrounded by a profile of the metal layer vertically projected on the top surface of the substrate.
7 . The micro-LED structure of claim 1 , wherein the insulating layer includes a protrusion protruding in a direction away from the substrate, the protrusion surrounding the opening of the insulating layer.
8 . The micro-LED structure of claim 1 , wherein the insulating layer includes at least one step structure corresponding to the metal layer.
9 . The micro-LED structure of claim 4 , wherein the plurality of the micro-LEDs are arranged side by side.
10 . The micro-LED structure of claim 5 , comprising:
a light-isolating wall formed on the transparent conductive layer between adjacent micro-LEDs.
11 . The micro-LED structure of claim 10 , wherein a height of the light-isolating wall is greater than or equal to a height of the adjacent micro-LEDs.
12 . The micro-LED structure of claim 10 , wherein the light isolating wall is formed under the exposed surface of the transparent isolation layer.
13 . The micro-LED structure of claim 9 , wherein the plurality of the micro-LEDs are configured to emit light having the same color.
14 . The micro-LED structure of claim 9 , wherein the plurality of the micro-LEDs are configured to emit light having different colors.
15 . The micro-LED structure of claim 9 ,
wherein the plurality of the micro-LEDs are arranged in an array.
16 . The micro-LED structure of claim 9 , wherein each one of the plurality of the micro-LEDs is configured to emit light with a color selected from red, green, blue, yellow, orange, and cyan.
17 . The micro-LED structure of claim 9 , wherein a pixel is formed by an array of the plurality of the micro-LEDs or by one of the plurality of the micro-LEDs.
18 . The micro-LED structure of claim 9 , wherein a pitch between adjacent micro-LEDs is less than 5 μm.
19 . The micro-LED structure of claim 9 , wherein the plurality of the micro-LEDs are formed to have the same size.
20 . The micro-LED structure of claim 9 , wherein the plurality of the micro-LEDs are formed to have different sizes.
21 . The micro-LED structure of claim 1 , wherein the substrate comprises:
a drive circuit configured to control the at least one micro-LED; and
an interconnection layer electrically connected to the metal layer of the at least one micro-LED.
21 . The micro-LED structure of claim 1 , wherein the metal layer contacts an entirety of a bottom surface of the light emitting layer.
22 . The micro-LED structure of claim 1 , wherein the insulating layer is formed at least at a sidewall of the at least one micro-LED.
23 . The micro-LED structure of claim 22 , wherein the insulating layer is further formed on a surface of the sidewall of the metal layer.
24 . The micro-LED structure of claim 22 , wherein the insulating layer is further formed on the substrate at a side of the metal layer.
25 . The micro-LED structure of claim 1 , wherein the light emitting layer comprises multiple layers.
26 . The micro-LED structure of claim 9 , wherein the insulating layer continuously convers the plurality of micro-LEDs.
27 . The micro-LED structure of claim 10 , wherein the light-isolating wall is formed of non-transparent material or metal.
28 . The micro-LED structure of claim 1 , wherein a size of a top surface area of the metal layer is greater than a size of a bottom surface area of the light emitting layer.
29 . The micro-LED structure of claim 1 , wherein a size of a top surface area of the metal layer is the same as a size of a bottom surface area of the light emitting layer.
30 . The micro-LED structure of claim 1 , wherein the opening of the insulating layer exposes an entirety of a top surface of the light emitting layer.
31 . The micro-LED structure of claim 10 , wherein a bottom of the light isolating wall is lower than a bottom surface of the light emitting layer or lower than a top surface of the metal layer.
32 . The micro-LED structure of claim 1 , wherein a bottom of the transparent conductive layer is lower than a bottom surface of the light emitting layer or lower than a top surface of the metal layer.