ECO-FRIENDLY PRINTED CIRCUIT BOARD FOR HIGH TEMPERATURE AND LOW TEMPERATURE APPLICATIONS

1 - 12 . (canceled)

13 . A method of fabricating a printed circuit board (PCB), comprising:

impregnating a first basalt fiber prepreg with epoxy resin;

placing a bottom surface of the first basalt fiber prepreg on a first copper layer;

placing a second copper layer on a top surface of the first basalt fiber prepreg;

placing a basalt fiber core on the second copper layer;

placing a third copper layer on a top surface of the basalt fiber core;

impregnating a second basalt fiber prepreg with epoxy resin;

placing a bottom surface of the second basalt fiber prepreg on a top surface of the third copper layer;

placing a fourth copper layer on a top surface of the second basalt fiber prepreg; and

compressing the basalt fiber core, the first basalt fiber prepreg, the second basalt fiber prepreg, the first copper layer, the second copper layer, the third copper layer and the fourth copper layer.

14 . The method of claim 13 , wherein compressing the basalt fiber core, the first basalt fiber prepreg, the second basalt fiber prepreg, the first copper layer, the second copper layer, the third copper layer and the fourth copper layer comprises compressing curing the basalt fiber core, the first basalt fiber prepreg, the second basalt fiber prepreg, the first copper layer, the second copper layer, the third copper layer and the fourth copper layer at a temperature between 170° C. and 175° C. at a pressure between 1 Megapascal (MPa) and 10 MPa for between three minutes and ten minutes.

15 . The method of claim 13 , further comprising cooling the compressed basalt fiber core, the first basalt fiber prepreg, the second basalt fiber prepreg, the first copper layer, the second copper layer, the third copper layer and the fourth copper layer.

16 . The method of claim 15 , wherein cooling the compressed basalt fiber core, the first basalt fiber prepreg, the second basalt fiber prepreg, the first copper layer, the second copper layer, the third copper layer and the fourth copper layer comprises water cooling the compressed basalt fiber core, the first basalt fiber prepreg, the second basalt fiber prepreg, the first copper layer, the second copper layer, the third copper layer and the fourth copper layer while applying a pressure between 1 Megapascal (MPa) and 10 MPa for between three minutes and five minutes.

17 . The method of claim 13 , wherein fabricating the first basalt fiber prepreg and the second basalt fiber prepreg comprises:

drying a basalt fiber fabric;

impregnating the basalt fiber fabric with the epoxy resin;

compression curing the basalt fiber fabric; and

cooling the basalt fiber fabric.

18 . The method of claim 17 , wherein drying the basalt fiber fabric comprises drying the basalt fiber fabric at a temperature between 70° C. and 100° C. for between thirty minutes and sixty minutes.

19 . The method of claim 17 , wherein compression curing the basalt fiber fabric comprises compression curing the basalt fiber fabric at a temperature between 170°° C. and 175° C. at a pressure between 1 Megapascal (MPa) and 10 MPa for between three minutes and five minutes.

20 . The method of claim 17 , wherein cooling the basalt fiber fabric comprises water cooling the basalt fiber fabric while applying a pressure between 1 Megapascal (MPa) and 10 MPa for between three minutes and five minutes.

21 . A method, comprising:

coupling a first copper layer to a first surface of a basalt fiber prepreg;

coupling a second copper layer to a second surface of the basalt fiber prepreg, the first copper layer, the basalt fiber prepreg and the second copper layer forming a core of a printed circuit board; and

compressing the first copper layer, the basalt fiber prepreg and the second copper layer.

22 . The method of claim 21 , wherein the basalt fiber prepreg includes a resin mixture.

23 . The method of claim 21 , wherein the basalt fiber prepreg includes a plurality of layers of basalt fiber fabric.

24 . The method of claim 23 , further comprising:

providing a resin mixture to at least one of the plurality of layers of basalt fiber fabric; and

compressing the plurality of layers of basalt fiber fabric.

25 . The method of claim 21 , further comprising:

coupling a third copper layer to a first surface of the core; and

coupling a fourth copper layer to a second surface of the core.

26 . The method of claim 25 , wherein the basalt fiber prepreg is a first basalt fiber prepreg, the method further comprising:

coupling a second basalt fiber prepreg to the third copper layer, the second basalt fiber prepreg comprising a resin mixture; and

coupling a third basalt fiber prepreg to the fourth copper layer, the third basalt fiber prepreg comprising the resin mixture.

27 . The method of claim 26 , further comprising compressing the core, the third copper layer, the fourth copper layer, the second basalt fiber prepreg and the third basalt fiber prepreg.

28 . A method, comprising:

stacking a first structure on a first side of a basalt fiber core, wherein the basalt fiber core comprises a first basalt fiber prepreg, a first metal layer and a second metal layer, and wherein the first structure comprises a second basalt fiber prepreg, a third metal layer and a fourth metal layer; and

stacking a second structure on a second side of the basalt fiber core, wherein the second structure comprises a third basalt fiber prepreg, a fifth metal layer and a sixth metal layer.

29 . The method of claim 28 , wherein the first metal layer comprises copper.

30 . The method of claim 28 , further comprising compressing the first structure, the basalt fiber core and the second structure.

31 . The method of claim 28 , wherein the basalt fiber core includes a resin mixture.

32 . The method of claim 28 , wherein at least one of the first basalt fiber prepreg, the second basalt fiber prepreg and the third basalt fiber prepreg comprises multiple layers of a basalt fiber fabric.