ELECTRONIC DEVICE
The electronic device includes a first substrate, an active device, a first conductive element, an insulating layer, a first support member, a second support member, and a package element. The active device is disposed on the first substrate and includes a gate and a semiconductor layer. The first conductive element is disposed on the first substrate and is a same layer of the gate of the active device. The insulating layer is disposed on the substrate. The first support member is disposed on the insulating layer and overlaps the first conductive element. The second conductive element is disposed on the first substrate. The second support member overlaps the second conductive element. The package element is disposed on the first substrate.
1 . An electronic device comprising:
a first substrate;
an active device disposed on the first substrate and comprising a gate and a semiconductor layer;
a first conductive element disposed on the first substrate, wherein the first conductive element is a same layer of the gate of the active device;
an insulating layer disposed on the substrate;
a first support member disposed on the insulating layer, wherein the first support member overlaps the first conductive element;
a second conductive element disposed on the first substrate;
a second support member overlapping the second conductive element; and
a package element disposed on the first substrate,
wherein in a cross-sectional view of the electronic device, at least a portion of the package element is disposed between the first support member and the second support member, and the insulating layer comprises a plurality of recesses overlapped with the package element; and
wherein in a top view of the electronic device, the first conductive element and the second conductive element extend in a same direction, and the semiconductor layer is disposed between the first conductive element and the second conductive element.
2 . The electronic device as claimed in claim 1 , wherein a height of the first support member and a height of the second support member are substantially the same.
3 . The electronic device as claimed in claim 1 , wherein at least a portion of package element is disposed in the plurality of recesses.