CERIUM-STABILIZED POLYAMIDES AND PROCESSES FOR MAKING SAME
A heat-stabilized polyamide composition comprising from 25 wt % to 90 wt % % of an amide polymer from 0.01 wt % to 10 wt % of a cerium-based heat stabilizer, a second heat stabilizer, a halide additive, and less than 0.3 wt % of a stearate additive. A weight ratio of halide additive to stearate additive is less than 45.0.
1 . A heat-stabilized polyamide composition comprising:
from 25 wt % to 90 wt % % of an amide polymer
from 0.01 wt % to 10 wt % of a cerium-based heat stabilizer,
from 0 wt % to 60 wt % of a filler
a second heat stabilizer,
a halide additive, and
less than 0.3 wt % of a stearate additive,
wherein a weight ratio of halide additive to stearate additive is less than 45.0.
2 . The polyamide composition of claim 1 , wherein the polyamide composition has a tensile strength of at least 75 MPa, when heat aged for 3000 hours over a temperature range of from 190° C. to 230° C., and measured at 23° C.
3 . The polyamide composition of claim 1 , wherein the polyamide composition has a tensile strength of at least 75 MPa, when heat aged for 3000 hours at a temperature of 180° C. and measured at 23° C.
4 . The polyamide composition of claim 1 , wherein the second heat stabilizer is present in an amount ranging from 0.01 wt % to 5 wt %.
5 . The polyamide composition of claim 1 , wherein the weight ratio of the cerium-based heat stabilizer to the second heat stabilizer ranges from 0.1 to 8.5.
6 . The polyamide composition of claim 1 , wherein the second heat stabilizer comprises greater than 350 wppm copper-based compound.
7 . The polyamide composition of claim 1 , wherein the weight ratio of halide additive to the stearate additive is less than 10.
8 . The polyamide composition of claim 1 , wherein the cerium-based heat stabilizer is a cerium ligand compound selected from the group consisting of cerium hydrates, cerium acetates, cerium oxyhydrate, cerium phosphate, and combinations thereof.
9 . The polyamide composition of claim 1 , wherein the activation temperature of the cerium-based heat stabilizer, measured in degrees centigrade, is at least 10% greater than the activation temperature of the second heat stabilizer, measured in degrees centigrade.
10 . The polyamide composition of claim 1 , wherein the cerium-based heat stabilizer is a cerium-based ligand compound; wherein the second heat stabilizer is a copper-based heat stabilizer, and wherein the polyamide composition has a tensile strength of at least 80 MPa, when heat aged for 3000 hours at a temperature of at least 220° C. and measured at 23° C.
11 . The polyamide composition of claim 1 , wherein the amide polymer comprises a first amide polymer and a second amide polymer.
12 . A heat-stabilized polyamide composition comprising:
from 25 wt % to 99 wt % of an amide polymer comprising:
greater than 90 wt %, based on the total weight of the amide polymer, of a low caprolactam content polyamide; and
less than 10 wt %, based on the total weight of the amide polymer, of a non-low caprolactam content polyamide from 0.01 wt % to 10 wt % of a cerium-based heat stabilizer, and a second heat stabilizer.
13 . The polyamide composition of claim 12 , wherein the low caprolactam content polyamide comprises PA-6,6/6; PA-6T/6; PA-6,6/6T/6; PA-6,6/61/6; PA-61/6; or 6T/61/6; or combinations thereof.
14 . The polyamide composition of claim 12 , wherein the polyamide composition has a tensile strength of at least 75 MPa, when heat aged for 3000 hours over a temperature range of from 190° C. to 230° C., and measured at 23° C.
15 . The polyamide composition of claim 12 , wherein the low caprolactam content polyamide comprises less than 50 wt % caprolactam.
16 . A heat-stabilized polyamide composition comprising:
from 25 wt % to 99 wt % of an amide polymer comprising:
greater than 90 wt %, based on the total weight of the amide polymer, of a low melt temperature polyamide; and
less than 10 wt %, based on the total weight of the amide polymer, of a non-low melt temperature polyamide;
from 0.01 wt % to 10 wt % of a cerium-based heat stabilizer, and a second heat stabilizer.
17 . The polyamide composition of claim 16 , wherein the low melt temperature polyamide comprises PA-6,6/6; PA-6T/6; PA-6,6/61/6; PA-61/6; or 6T/61/6; or combinations thereof.
18 . The polyamide composition of claim 16 , wherein the polyamide composition has a tensile strength of at least 75 MPa, when heat aged for 3000 hours over a temperature range of from 190° C. to 230° C., and measured at 23° C.
19 . The polyamide composition of claim 16 , wherein the low melt temperature polyamide has a melt temperature below 210° C.
20 . A heat-stabilized polyamide composition comprising:
from 25 wt % to 99 wt % of an amide polymer
from 0.01 wt % to 10 wt % of cerium oxide and/or cerium oxyhydrate,
a second heat stabilizer,
a halide additive, and
less than 0.3 wt % of a stearate additive,
wherein a weight ratio of halide additive to stearate additive is less than 45.0, and
wherein the polyamide composition optionally has a tensile strength of at least 75 MPa, when heat aged for 3000 hours over a temperature range of from 190° C. to 230° C., and measured at 23° C.
21 . The polyamide composition of claim 20 , wherein the polyamide composition comprises iodide present in an amount ranging from 30 wppm to 5000 wppm.
22 . The polyamide composition of claim 20 , wherein the polyamide composition comprises cerium oxide and/or cerium oxyhydrate in an amount ranging from 10 ppm to 9000 ppm.
23 . The polyamide composition of claim 20 , wherein the amide polymer comprises:
greater than 90 wt %, based on the total weight of the amide polymer, of a low caprolactam content polyamide; and
less than 10 wt %, based on the total weight of the amide polymer, of a non-low caprolactam content polyamide or a non-low melt temperature polyamide.