SEMICONDUCTOR DEVICE
A semiconductor device includes a circuit substrate, a light-emitting layer, a structure, and a light-emitting diode chip. The light-emitting layer is located on the circuit substrate and emits a first color light with a first wavelength range. The structure is disposed between the light-emitting layer and the circuit substrate. The structure emits a second color light with a second wavelength range. The light-emitting diode chip is located on the circuit substrate without overlapping the structure in a vertical direction. The light-emitting diode chip emits a third color light with a third wavelength range. The first wavelength range is between the second wavelength range and the third wavelength range.
1 . A semiconductor device, comprising:
a circuit substrate;
a light-emitting layer on the circuit substrate and emitting a first color light with a first wavelength range;
a structure disposed between the light-emitting layer and the circuit substrate and emitting a second color light with a second wavelength range; and
a light-emitting diode chip on the circuit substrate without overlapping the structure in a vertical direction and emitting a third color light with a third wavelength range;
wherein the first wavelength range is between the second wavelength range and the third wavelength range.
2 . The semiconductor device as claimed in claim 1 , further comprising a first circuit layer and a second circuit layer on the structure and the light-emitting layer, wherein the first circuit layer and the second circuit layer are electrically connected to the structure and the light-emitting layer.
3 . The semiconductor device as claimed in claim 2 , wherein the first circuit layer and the second circuit layer respectively have a first bonding surface and a second bonding surface, and the first bonding surface and the second bonding surface are coplanar with each other.
4 . The semiconductor device as claimed in claim 3 , further comprising a passivation layer covering the structure and the light-emitting layer, wherein the passivation layer has openings located on the first bonding surface and the second bonding surface.
5 . The semiconductor device as claimed in claim 3 , wherein vertical projections of the first bonding surface and the second bonding surface are both overlapped with a vertical projection of the light-emitting layer.
6 . The semiconductor device as claimed in claim 4 , further comprising a distributed Bragg reflector sandwiched between the passivation layer and the light-emitting layer.
7 . The semiconductor device as claimed in claim 6 , wherein the distributed Bragg reflector comprises an opening aligned with one of the openings of the passivation layer.
8 . The semiconductor device as claimed in claim 6 , wherein the distributed Bragg reflector is in contact with the first circuit layer and the second circuit layer.
9 . The semiconductor device as claimed in claim 1 , further comprising a distributed Bragg reflector covering the light-emitting layer and the structure.
10 . The semiconductor device as claimed in claim 9 , further comprising an insulating layer between the distributed Bragg reflector and the light-emitting layer.
11 . The semiconductor device as claimed in claim 1 , further comprising a semiconductor layer, wherein the light-emitting layer is disposed between the semiconductor layer and the structure.
12 . The semiconductor device as claimed in claim 11 , further comprising a first trench formed in the light-emitting layer.
13 . The semiconductor device as claimed in claim 12 , wherein the first trench is further formed in the semiconductor layer.
14 . The semiconductor device as claimed in claim 11 , further comprising a first electrode located in the first trench and contacting the semiconductor layer.
15 . The semiconductor device as claimed in claim 14 , further comprising a second trench formed in the light-emitting diode chip.
16 . The semiconductor device as claimed in claim 15 , further comprising a second electrode located in the second trench and electrically connected to the light-emitting diode chip.
17 . The semiconductor device as claimed in claim 15 , wherein the second electrode is closer to the circuit substrate than the first electrode.