DRY ADHESIVE FOR TEMPORARY BONDING OF SEMICONDUCTOR DEVICES
A dry adhesive microfiber array comprising a plurality of fibers with enlarged tips, where the dry adhesive is capable of adhering to a surface of a silicon wafer and/or carrier, in which the dry adhesive can be debonded without the use of chemicals or heat and does not leave a residue on the surface of the wafer, and, a liquid can be introduced to the interface between the dry adhesive and semiconductor device to adjust the force of adhesion.
1 . A method of bonding a semiconductor device comprising:
providing a dry adhesive including a microfiber array having a plurality of fibers; and
adhering tips of the microfiber array to a surface of the semiconductor device, wherein the microfiber array is in a wet state.
2 . The method of claim 1 , wherein the wet state is due to a liquid, and the liquid has a characteristic that the liquid does not provide direct adhesion.
3 . The method of claim 1 , wherein the wet state is due to a liquid, and the liquid is not an adhesive.
4 . The method of claim 1 , wherein the dry adhesive is formed as a thin film or a tape, from whose surface the microfiber array extends.
5 . The method of claim 1 , further comprising:
debonding the microfiber array from the semiconductor device through a mechanical movement.
6 . The method of claim 5 , wherein the mechanical movement comprises peeling the microfiber array from the semiconductor device, or the mechanical movement comprises a movement of the semiconductor device in a direction parallel to the surface of the dry adhesive.
7 . The method of claim 5 , further comprising:
drying the microfiber array before the debonding the microfiber array from the semiconductor device.
8 . The method of claim 7 , wherein the drying utilizes cold or heated air.
9 . The method of claim 1 , wherein the bonding is performed at room temperature.
10 . The method of claim 5 , wherein the debonding is performed at room temperature.
11 . The method of claim 1 , further comprising:
processing the semiconductor device while the semiconductor device is adhered to the microfiber array.
12 . The method of claim 11 , wherein the processing the semiconductor device includes processing a backside of the semiconductor device.
13 . The method of claim 1 , wherein the semiconductor device is a silicon wafer, chip, die, or semiconductor package.
14 . The method of claim 1 , wherein the method is applied to a wafer-level packaging process.
15 . A method of manufacturing a semiconductor device, comprising
processing the semiconductor device according to the method of claim 11 .
16 . A method of manufacturing a semiconductor device, comprising
processing the backside of the semiconductor device according to the method of claim 12 .