SEMICONDUCTOR DEVICE WITH ANTENNA AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH ANTENNA
A semiconductor device with an antenna includes: a semiconductor chip having a first chip surface, and a circuit surface located opposite the first chip surface; a heat dissipation part having a first surface, and a second surface located opposite the first surface and in contact with the first chip surface of the semiconductor chip; a wiring board having a first board surface, a second board surface located opposite the first board surface, and a laminate in which an insulating layer formed of a resin and an interconnect layer formed of a metal are laminated, wherein the wiring board covers side surfaces of the heat dissipation part and of the semiconductor chip and the circuit surface of the semiconductor chip, and exposes the first surface of the heat dissipation part at the first board surface; and the antenna provided on the second board surface of the wiring board.
1 . A semiconductor device with an antenna, the semiconductor device comprising:
a semiconductor chip having a first chip surface, and a circuit surface located opposite the first chip surface;
a heat dissipation part having a first surface, and a second surface located opposite the first surface and in contact with the first chip surface of the semiconductor chip;
a wiring board having a first board surface located on a first surface side of the heat dissipation part, a second board surface located opposite the first board surface, and a laminate in which an insulating layer formed of a resin and an interconnect layer formed of a metal are laminated, wherein the wiring board covers side surfaces of the heat dissipation part and of the semiconductor chip and the circuit surface of the semiconductor chip, and exposes the first surface of the heat dissipation part at the first board surface; and
the antenna provided on the second board surface of the wiring board, wherein
the wiring board further includes
board connection parts provided in a region of the first board surface located outward of an outer periphery of the semiconductor chip in a plan view, and in a region of the first board surface located inward of the outer periphery of the semiconductor chip and outward of an outer periphery of the first surface of the heat dissipation part in the plan view,
a first interconnect connecting the board connection parts to a first terminal provided on the circuit surface of the semiconductor chip, and
a second interconnect connecting the antenna to a second terminal provided on the circuit surface of the semiconductor chip.
2 . The semiconductor device with the antenna according to claim 1 , wherein
the heat dissipation part includes a first metal layer provided on the first chip surface of the semiconductor chip, and
the second surface is a surface of the first metal layer in contact with the first chip surface.
3 . The semiconductor device with the antenna according to claim 2 , wherein the first metal layer is provided on an entirety of the first chip surface of the semiconductor chip.
4 . The semiconductor device with the antenna according to claim 2 , wherein
the heat dissipation part further includes
a second metal layer provided on a first surface side of the heat dissipation part relative to the first metal layer,
an interlayer insulating layer provided between the first metal layer and the second metal layer, and
a plurality of vias penetrating through the interlayer insulating layer and connecting the first metal layer and the second metal layer,
the first metal layer and the second metal layer are each formed together with the interconnect layer of the wiring board, and
the interlayer insulating layer is formed together with the insulating layer of the wiring board.
5 . The semiconductor device with the antenna according to claim 4 , wherein a surface of the second metal layer located opposite the first metal layer is the first surface of the heat dissipation part.
6 . The semiconductor device with the antenna according to claim 4 , wherein the second metal layer is located inward of an outer periphery of the first metal layer in the plan view.
7 . The semiconductor device with the antenna according to claim 6 , wherein the outer periphery of the first metal layer and an outer periphery of the second metal layer each have a rectangular shape in the plan view.
8 . The semiconductor device with the antenna according to claim 6 , wherein the outer periphery of the second metal layer has a projecting portion protruding outward or a recessed portion recessed inward in the plan view.
9 . The semiconductor device with the antenna according to claim 5 , wherein at least a portion of the second metal layer is located outward of the outer periphery of the first metal layer in the plan view.
10 . The semiconductor device with the antenna according to claim 1 , further comprising:
a plurality of connection terminals of a same type, wherein
the plurality of connection terminals are provided on the board connection parts at the first board surface, and provided on the first surface of the heat dissipation part.
11 . The semiconductor device with the antenna according to claim 1 , wherein the wiring board includes a redistribution layer.
12 . A method of manufacturing a semiconductor device with an antenna, the semiconductor device including
a semiconductor chip having a first chip surface, and a circuit surface located opposite the first chip surface,
a heat dissipation part having a first surface, and a second surface located opposite the first surface and in contact with the first chip surface of the semiconductor chip,
a wiring board having a first board surface located on a first surface side of the heat dissipation part, a second board surface located opposite the first board surface, and a laminate in which an insulating layer formed of a resin and an interconnect layer formed of a metal are laminated, wherein the wiring board covers side surfaces of the heat dissipation part and of the semiconductor chip and the circuit surface of the semiconductor chip, and exposes the first surface of the heat dissipation part at the first board surface, and
the antenna provided on the second board surface of the wiring board, the method comprising:
fabricating the wiring board by laminating the insulating layer formed of the resin and the interconnect layer formed of the metal, wherein
the fabricating of the wiring board includes
providing board connection parts in a region of the first board surface located outward of an outer periphery of the semiconductor chip in a plan view, and in a region of the first board surface located inward of the outer periphery of the semiconductor chip and outward of an outer periphery of the first surface of the heat dissipation part in the plan view,
fabricating a first interconnect connecting the board connection parts to a first terminal provided on the circuit surface of the semiconductor chip, and
fabricating a second interconnect connecting the antenna to a second terminal provided on the circuit surface of the semiconductor chip.