ANTENNA-EQUIPPED SUBSTRATE DEVICE, ARRAY ANTENNA DEVICE, AND METHOD OF MANUFACTURING ANTENNA-EQUIPPED SUBSTRATE DEVICE
An antenna-equipped substrate device includes a wiring board having a plurality of insulating layers; an antenna having a first antenna element provided on a first surface of the wiring board; an amplifier provided on the first surface of the wiring board and connected to the first antenna element. The wiring board has a first portion where the antenna is provided and a second portion where the amplifier is provided. A thickness of the first portion of the wiring board is thinner than a thickness of the second portion of the wiring board.
1 . An antenna-equipped substrate device comprising:
a wiring board having a plurality of insulating layers;
an antenna having a first antenna element provided on a first surface of the wiring board;
an amplifier provided on the first surface of the wiring board and connected to the first antenna element, wherein
the wiring board has a first portion where the antenna is provided and a second portion where the amplifier is provided, and
a thickness of the first portion of the wiring board is thinner than a thickness of the second portion of the wiring board.
2 . The antenna-equipped substrate device according to claim 1 , wherein the antenna is configured to radiate a radio wave in a direction away from a side surface of the wiring board.
3 . The antenna-equipped substrate device according to claim 1 , wherein a number of the insulating layers in the first portion of the wiring board is smaller than a number of the insulating layers in the second portion of the wiring board.
4 . The antenna-equipped substrate device according to claim 1 , wherein
the wiring board having the plurality of insulating layers has one or more first insulating layers and one or more second insulating layers that are laminated from the first surface,
the first portion is provided with the one or more first insulating layers but is not provided with the plurality of second insulating layers, and
the second portion is provided with the one or more first insulating layers and the plurality of second insulating layers.
5 . The antenna-equipped substrate device according to claim 4 , wherein on a second surface opposite to the first surface, a portion of the first portion adjacent to the one or more second insulating layers of the second portion, is a portion where one or more insulating layers identical to the one or more second insulating layers have been removed by etching.
6 . The antenna-equipped substrate device according to claim 5 , wherein the antenna further includes a second antenna element provided on the second surface.
7 . The antenna-equipped substrate device according to claim 5 , wherein
the etching is wet etching,
each of the one or more second insulating layers is made of an insulating material that has photosensitivity and that can be removed by the wet etching with light irradiation, and
each of the one or more first insulating layers is made of an insulating material that does not have the photosensitivity.
8 . The antenna-equipped substrate device according to claim 2 , wherein
a plurality of the antennas are provided, and
the plurality of the antennas are arranged along the side surface.
9 . An array antenna device comprising:
a plurality of the antenna-equipped substrate devices according to claim 2 , wherein
the plurality of the antenna-equipped substrate devices are arranged at predetermined intervals along a direction penetrating the first surface, with positions and directions of the side surfaces aligned.
10 . A method of manufacturing an antenna-equipped substrate device, the antenna-equipped substrate device including:
a wiring board having a plurality of insulating layers;
an antenna having a first antenna element provided on a first surface of the wiring board;
an amplifier provided on the first surface of the wiring board and connected to the first antenna element, wherein
the wiring board has a first portion where the antenna is provided and a second portion where the amplifier is provided, the method comprising:
removing, by etching, a portion of the first portion on a side opposite to the first surface, such that a thickness of the first portion of the wiring board is thinner than a thickness of the second portion of the wiring board.