Sliding Thermal Interface Material (TIM) Assemblies

1 .- 20 . (canceled)

21 . A thermal management assembly for sliding applications, the assembly comprising:

a substrate having opposite inner and outer surfaces; and

an interface material along the inner surface of the substrate;

wherein the substrate defines a durable layer that is disposed over and/or along the interface material and that is configured to contact a first surface of a first component when the thermal management assembly is along a second surface of a second component and when the first surface is slidably moved relative to the second surface.

22 . The assembly of claim 21 , wherein:

the substrate comprises a metal cover having an outer sliding surface and an inner surface;

the interface material is disposed on the inner surface of the metal cover;

a plurality of inwardly protruding dimples are along spaced-apart spring fingers of the metal cover, the dimples configured to be received in corresponding sockets of a heat-removal component; and

a heat transfer path extends through the metal cover, the interface material, and into the heat-removal component.

23 . The assembly of claim 22 , wherein first and second adhesive reinforcement strips are positioned on opposite edges of the interface material and extend along edges that are perpendicular to a sliding direction, whereby the interface material is confined between the first and second adhesive reinforcement strips such that, during sliding insertion of a heat source along the outer sliding surface of the metal cover, the first and second adhesive reinforcement strips absorb edge compression and inhibit migration of the interface material.

24 . The assembly of claim 23 , wherein:

the metal cover comprises stainless steel;

the interface material comprises a thermal phase-change material; and

each of the first and second adhesive reinforcement strips comprises a polymer film with pressure-sensitive adhesive on opposed sides.

25 . The assembly of claim 23 , wherein:

the metal cover comprises stainless steel having a thickness from 50 microns to 100 microns;

the interface material comprises a thermal phase-change material having a through-plane thermal conductivity from 5 Watts per meter per Kelvin (W/m-K) to 15 W/m-K; and

each of the first and second adhesive reinforcement strips comprises a polymer film with pressure-sensitive adhesive on opposed sides and has a total thickness from 75 microns to 150 microns.

26 . The assembly of claim 22 , wherein the metal cover has a thermal conductivity at least ten times greater than a polyimide film of equal thickness.

27 . The assembly of claim 22 , wherein:

the spring fingers are integral with sidewalls of the metal cover; and

the sockets are notches in a pedestal of a heat sink.

28 . The assembly of claim 21 , wherein the thickness of the interface material after burn-in is reduced by 10% to 40% relative to a pre burn-in thickness of the interface material.

29 . The assembly of claim 21 , wherein the substrate comprises a metal substrate including stainless steel, copper, or beryllium copper.

30 . The assembly of claim 21 , wherein:

the durable layer is wear-resistant and puncture resistant; and

the durable layer has a higher thermal conductivity than polyimide film and is more wear-resistant and puncture resistant than polyimide film.

31 . The assembly of claim 21 , wherein the substrate comprises a metal substrate defining a metal wear-resistant layer that is disposed over and/or along the interface material and that is configured to slide along in contact with the first surface of the first component when the thermal management assembly is along the second surface of the second component and when the first surface is slidably moved relative to the second surface.

32 . The assembly of claim 21 , wherein:

the first component comprises a heat source;

the second component comprises a heat sink; and

the thermal management assembly is applied to the heat sink such that the interface material is between the heat sink and the durable layer and such that the durable layer is between the interface material and the heat source; and

the durable layer is configured to slide relatively along in contact with the heat source when the heat source is slidably moved relative to the heat sink and the thermal management assembly applied to the heat sink.

33 . The assembly of claim 21 , wherein:

the first component comprises a heat sink;

the second component comprises a heat source; and

the thermal management assembly is applied to the heat source such that the interface material is between the heat source and the durable layer and such that the durable layer is between the interface material and the heat sink; and

the durable layer is configured to slide relatively along in contact with the heat sink when the heat source (and the thermal management assembly applied to the heat source) is slidably moved relative to the heat sink.

34 . The assembly of claim 21 , wherein:

the durable layer has a thickness within a range from about 17.5 microns to about 300 microns; and

the interface material has a thermal conductivity within a range from about 1 W/m-K to about 50 W/m-K.

35 . The assembly of claim 21 , wherein the substrate includes inwardly protruding portions along spaced-apart fingers of the substrate that are configured to be engagingly received within openings along a heat sink, heat source, or other component.

36 . The assembly of claim 21 , further comprising first and second portions of adhesive respectively adjacent opposite front and back edge portions of the interface material, wherein the first and second portions of adhesive provide reinforcement along the front and back edge portions of the interface material that helps to confine the interface material within an area defined by the reinforcement and thereby inhibits migration of the interface material.

37 . The assembly of claim 21 , wherein:

the interface material comprises a thermally-conductive pad, a thermally-conductive gap filler, a phase change thermal interface material, a dispensable thermal interface material, a thermal putty, and/or a thermal grease;

the substrate is configured to preserve the interface material as a heat source or other component slides in and out of position relative to the thermal management assembly; and

the thermal management assembly is configured to improve heat transfer between a slidable heat source and heat sink via the substrate defining the durable layer over and/or along the interface material, thereby providing a durable, slide-resistant interface material with improved performance.

38 . The assembly of claim 21 , wherein:

the assembly further comprises a removable protective liner disposed over the interface material with tear tabs aligned to the sliding direction; and

the substrate preserves the interface material during repeated sliding insertion and removal cycles and maintains a thermal path through the substrate and the interface material.

39 . A thermal management assembly for sliding applications, the assembly comprising:

a metal cover having an outer sliding surface and an inner surface;

an interface material disposed on the inner surface of the metal cover;

a plurality of inwardly protruding dimples along spaced-apart spring fingers of the metal cover, the dimples configured to be received in corresponding sockets of a heat-removal component; and

first and second adhesive reinforcement strips positioned on opposite edges of the interface material and extend along edges that are perpendicular to a sliding direction, whereby the interface material is confined between the first and second adhesive reinforcement strips such that, during sliding insertion of a heat source along the outer sliding surface of the metal cover, the first and second adhesive reinforcement strips absorb edge compression and inhibit migration of the interface material;

wherein the metal cover preserves the interface material such that the interface material is durable during repeated sliding insertion and removal cycles and such that a heat transfer path is maintained through the metal cover, the interface material, and into the heat-removal component.

40 . A device comprising:

a heat sink having sockets along sidewalls of a pedestal;

a thermal management assembly according to claim 39 engaged to the heat sink by receipt of the dimples along spaced-apart spring fingers of the metal cover into the sockets along the sidewalls of the pedestal; and

a heat source configured to be slid into and out of thermal contact with the outer sliding surface of the metal cover;

wherein the metal cover preserves the interface material during repeated sliding insertion and removal cycles and maintains a thermal path from the heat source through the metal cover and the interface material into the heat sink.