INTEGRATED PHOTONICS ASSEMBLIES
Disclosed herein are integrated photonics assemblies, circuits, systems and methods therefor. The systems can include a first integrated photonics assembly having a first functionality, in which the first assembly includes a plurality of modular photonic integrated subcircuits. Each subcircuit can be pre-fabricated and can be configured to transfer light to and receive light from another subcircuit based on the first functionality. An output port of a first subset of the subcircuits can be configured to be aligned with an input port of a second subset of the subcircuits. At least one subcircuit can be configured to be removed from the first integrated photonics assembly and connected to a second integrated photonics assembly having a second functionality. The first integrated photonics assembly can be different from the second integrated photonics assembly and the first functionality can be different from the second functionality.
1 . A system comprising:
a first assembly comprising a first integrated photonics assembly having a first functionality, the first assembly comprising:
a plurality of subcircuits comprising a plurality of modular photonic integrated subcircuits; and
a receptacle configured align at least two subcircuits of the plurality of subcircuits, wherein:
an output port of a first subset of the plurality of subcircuits is configured to be aligned with an input port of a second subset of the plurality of subcircuits; and
the input port and the output port are optical ports wherein light is transferred from the output port to the input port.
2 . The system of claim 1 , wherein a surface of the receptacle comprises at least one alignment feature, the alignment feature configured to effectuate alignment between a first subcircuit and a second subcircuit of the at least two subcircuits.
3 . The system of claim 2 , wherein the alignment feature effectuates at least one of (a) a lateral alignment, (b) a vertical alignment, or (c) an angular alignment between a first subcircuit and a second-subcircuit of the at least two subcircuits.
4 . The system of claim 2 , wherein a surface of each of the at least two subcircuits forms a cavity configured to receive the alignment feature of the receptacle.
5 . The system of claim 4 , wherein the cavity is a deep etch, a V-groove, or an oxide open.
6 . The system of claim 1 , wherein light is transferred from the output port to the input port with a coupling efficiency greater than 90%.
7 . The system of claim 1 , wherein at least two subcircuits are configured to transfer and receive light via butt-coupling.
8 . The system of claim 1 , further comprising a plurality of monitoring circuits, wherein:
each monitoring circuit is coupled to a respective one of a subset of the plurality of subcircuits,
each monitoring circuit comprises a first light path between an input and an output of the subcircuit, and
each monitoring circuit is configured to monitor optical loss in the light path.
9 . The system of claim 1 , wherein, based on the monitored optical loss, the monitoring circuit is configured to determine at least one of (i) a coupling efficiency or (ii) a degree of alignment between the respective subcircuit and another subcircuit immediately adjacent to the respective subcircuit.
10 . The system of claim 1 , wherein each monitoring circuit comprises a second light path configured to monitor light transferred in an opposite direction from light transferred in the first light path.
11 . The system of claim 1 , further comprising a second plurality of monitoring circuits, wherein:
each second monitoring circuit is coupled to the respective one of the subset of the plurality of subcircuits,
each second monitoring circuit comprises a light path between an input and an output of the subcircuit, and
each second monitoring circuit is configured to monitor optical loss in the light path.
12 . The system of claim 1 , further comprising:
a fiber optic array configured to transfer light via an optical path to the monitoring circuit.
13 . A method for aligning two or more photonic integrated subcircuits, the method comprising:
providing at least two photonic integrated subcircuits, wherein:
an output port of a first subcircuit of the subcircuits is configured to be aligned with an input port of a second subcircuit of the subcircuits; and
the input port and the output port are optical ports wherein light is transferred from the output port to the input port;
providing at least one receptacle configured to align the at least two photonic integrated subcircuits; and
positioning the subcircuits onto the receptacle such that the output port of the first subcircuit is aligned with the input port of the second subcircuit.
14 . The method of claim 13 , wherein the output port of the first subcircuit is an optical output port and the input port the second subcircuit is an optical input port.
15 . The method of claim 14 , wherein light is transferred from the output port to the input port with a coupling efficiency greater than 90%
16 . The method of claim 13 , wherein a surface of the receptacle comprises at least one alignment feature, the alignment feature configured to effectuate alignment between a first subcircuit and a second subcircuit of the at least two subcircuits.
17 . The method of claim 16 , wherein the alignment feature effectuates at least one of (a) a lateral alignment, (b) a vertical alignment, or (c) an angular alignment between a first subcircuit and a second-subcircuit of the at least two subcircuits.
18 . The method of claim 16 , wherein a surface of each of the at least two subcircuits forms a cavity configured to receive the alignment feature of the receptacle.
19 . The method of claim 18 , wherein the cavity is a deep etch, a V-groove, or an oxide open.
20 . The method of claim 13 , wherein at least two subcircuits are configured to transfer and receive light via butt-coupling.