THERMAL MANAGEMENT PLANES
Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.
1 . A thermal management plane comprising:
a top casing comprising at least a polymer layer, the top casing is hermetically sealed and bondable with copper;
a bottom casing that is hermetically sealed and bondable with copper;
a wick disposed between the top casing and the bottom casings, wherein the wick has a non-tubular shape;
a working fluid disposed between the top casing and the bottom casing; and
a low-temperature, copper hermetic seal between an outer periphery of the top casing and the bottom casing, wherein the low-temperature is a temperature lower than 300° C.
2 . The thermal management plane according to claim 1 , wherein the hermetic seal comprises a seam-weld, a laser-weld, or a diffusion bond.
3 . The thermal management plane according to claim 1 , wherein the top casing comprises a non-copper layer encapsulated with a copper layer.
4 . The thermal management plane according to claim 1 , further comprising a vapor core having a thickness of about 80-200 microns.
5 . The thermal management plane according to claim 1 , wherein the hermetic seal comprises a plurality of copper nanoparticles.
6 . The thermal management plane according to claim 1 , wherein the thermal management plane has a thickness less than about 200 microns.
7 . A thermal management plane comprising:
a top casing that is hermetically sealed and bondable with copper;
a bottom casing that is hermetically sealed and bondable with copper, the bottom casing comprising a plurality of deformations that form a plurality of pillars;
a wick layer disposed on the plurality of pillars, wherein the wick layer has a non-tubular shape;
a working fluid disposed between the top casing and the bottom casing; and
a copper hermetic seal that seals a periphery an outer periphery of the top casing and the bottom casing.
8 . The thermal management plane according to claim 7 , wherein the top casing comprises a polymer encapsulated with copper.
9 . The thermal management plane according to claim 7 , wherein copper hermetic seal is a low-temperature hermetic seal, wherein the low-temperature is a temperature lower than 300° C.
10 . The thermal management plane according to claim 7 , wherein the copper hermetic seal comprises a seam-weld, a laser-weld, or a diffusion bond.
11 . A thermal management plane comprising:
a top casing that is hermetically sealed and bondable with copper, the top casing comprising at least one polymer layer;
a bottom casing that is hermetically sealed and bondable with copper;
a wick disposed between the top casing and the bottom casing,
a working fluid disposed between the top casing and the bottom casing; and
a copper hermetic seal that seals a periphery of the top casing and the bottom casing, wherein either or both the top casing and the bottom casing include a deformation that forms structure support.
12 . The thermal management plane according to claim 11 , wherein copper hermetic seal is a low-temperature hermetic seal, wherein the low-temperature is a temperature lower than 300° C.
13 . The thermal management plane according to claim 11 , wherein the copper hermetic seal comprises a seam-weld, a laser-weld, or a diffusion bond.
14 . A thermal management plane comprising:
a top casing that is hermetically sealed and bondable with copper;
a bottom casing that is hermetically sealed and bondable with copper;
a wick disposed between the top casing and the bottom casings, wherein the wick has a non-tubular shape;
a working fluid disposed between the top casing and the bottom casing; and
a low-temperature, diffusion bond between an outer periphery of the top casing and the bottom casing, wherein the low-temperature is a temperature lower than 300° C.
15 . The thermal management plane according to claim 14 , wherein the top casing comprises a polymer layer.
16 . The thermal management plane according to claim 14 , wherein the top casing comprises a non-copper layer encapsulated with a copper layer.
17 . The thermal management plane according to claim 14 , further comprising a vapor core having a thickness of about 80-200 microns.
18 . The thermal management plane according to claim 14 , wherein the hermetic seal comprises a plurality of copper nanoparticles.
19 . A thermal management plane comprising:
a top casing that is hermetically sealed and bondable with copper;
a bottom casing that is hermetically sealed and bondable with copper;
a wick disposed between the top casing and the bottom casing, wherein the wick has a non-tubular shape, the wick includes a plurality of arteries formed within the wick by removing portions of the wick;
a working fluid disposed between the top casing and the bottom casing; and
a hermetic seal between an outer periphery of the top casing and the bottom casing.
20 . The thermal management plane according to claim 19 , wherein the hermetic seal comprises a low-temperature diffusion bond, wherein the low-temperature is a temperature lower than 300° C.