IP Library › Patent Application 19699518
Patent Application Re-Issue
App. No. 19/699,518 · Confirmation No. 9106

SYSTEM AND METHOD FOR PROVIDING 3D WAFER ASSEMBLY WITH KNOWN-GOOD-DIES

Inventor: Hong Shen
Application Undergoing Preexam Processing
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2026-06-05 ABST Abstract — View
2026-06-05 A.PE Preliminary Amendment — View
2026-06-05 A.PE Preliminary Amendment — View
2026-06-05 SPEC Specification — View
2026-06-05 CLM Claims — View
2026-06-05 REM Applicant Arguments/Remarks Made in an Amendment — View
2026-06-05 ADS Application Data Sheet — View
2026-06-05 REIS.DECL Reissue Oath or Declaration — View
2026-06-05 REIS.CONSENT Consent of Assignee accompanying the declaration — View
2026-06-05 R3.73 Assignee showing of ownership per 37 CFR 3.73 — View
2026-06-05 TRREISS Transmittal Reissue Application — View
2026-06-05 PA.. Power of Attorney — View
2026-06-05 ABST Abstract — View
2026-06-05 SPEC Specification — View
2026-06-05 DRW.NONBW Drawings-other than black and white line drawings — View
2026-06-05 SPEC Specification — View
2026-06-05 FOR Foreign Reference — View
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2026-06-05 DRW.SUPP Drawings-black and white line and/or other drawings — View
2026-06-05 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
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Quick Facts
App. No.
19/699,518
Effective Filing
2026-06-05