IP Library › Granted Patent US 503,691
Granted Patent S1
US 503,691 · App. 29/188,754 · Granted Apr 5, 2005

Conductive clip for a semiconductor package

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Quick Facts
Patent No.
US 503,691
App. No.
29/188,754
Granted
Apr 5, 2005
Kind
S1
Claims (1)

The ornamental design for a conductive clip for a semiconductor package, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 19, 2004
From: STANDING, MARTIN; SCHOFIELD, HAZEL DEBORAH
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 014867/0348 →