Granted Patent
S1
US 534,133 · App. 29/238,803 · Granted Dec 26, 2006
Semiconductor module
View Patent ↗
Loading inventors, assignments & file history…
Claims (1)
The ornamental design for a semiconductor module, as shown.
Assignments (3)
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS, TRADEMARKS AND TRADENAMES
Recorded Jun 30, 2021
From: BANK OF AMERICA, N.A. (AS SUCCESSOR-IN-INTEREST TO LASALLE BANK)
To: SLOAN VALVE COMPANY
Reel/Frame 056728/0307 →
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Sep 22, 2005
From: HIGASHIBATA, KAZUAKI
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 017022/0411 →
SECURITY AGREEMENT
Recorded Sep 26, 2003
From: SLOAN VALVE COMPANY
To: LASALLE BANK, N.A.
Reel/Frame 014683/0095 →