IP Library › Granted Patent US 560,126
Granted Patent S1
US 560,126 · App. 29/261,916 · Granted Jan 22, 2008

Dual temperature sensor assembly

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Quick Facts
Patent No.
US 560,126
App. No.
29/261,916
Granted
Jan 22, 2008
Kind
S1
Claims (1)

The ornamental design for a dual temperature sensor assembly, as shown and described.

Assignments (2)
PATENT SECURITY AGREEMENT (SHORT FORM) Recorded Mar 3, 2021
From: WATLOW ELECTRIC MANUFACTURING COMPANY
To: BANK OF MONTREAL, AS ADMINISTRATIVE AGENT
Reel/Frame 055479/0708 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 22, 2006
From: FRAKE, ROBERT K.; CULBERTSON, DAVID P.; HARVEY, DANIEL D.
To: WATLOW ELECTRIC MANUFACTURING COMPANY
Reel/Frame 018011/0904 →