IP Library › Granted Patent US 546,847
Granted Patent S1
US 546,847 · App. 29/275,835 · Granted Jul 17, 2007

Molding-system platen

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Quick Facts
Patent No.
US 546,847
App. No.
29/275,835
Granted
Jul 17, 2007
Kind
S1
Claims (1)

We claim the ornamental design for a molding-system platen, as shown and described.

Assignments (4)
SECURITY AGREEMENT Recorded Apr 2, 2018
From: HUSKY INJECTION MOLDING SYSTEMS LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 045803/0846 →
RELEASE OF SECURITY AGREEMENT Recorded Jul 19, 2011
From: ROYAL BANK OF CANADA
To: HUSKY INJECTION MOLDING SYSTEMS LTD.
Reel/Frame 026647/0595 →
SECURITY AGREEMENT Recorded Jan 30, 2008
From: HUSKY INJECTION MOLDING SYSTEMS LTD.
To: ROYAL BANK OF CANADA
Reel/Frame 020431/0495 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 8, 2007
From: TENG, ALEX, MR.; NOGUEIRA, JOAQUIM MARTINS, MR.
To: HUSKY INJECTION MOLDING SYSTEMS LTD.
Reel/Frame 018722/0484 →