IP Library › Granted Patent US 571,294
Granted Patent S1
US 571,294 · App. 29/278,514 · Granted Jun 17, 2008

Ultracapacitor module assembly design

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Quick Facts
Patent No.
US 571,294
App. No.
29/278,514
Granted
Jun 17, 2008
Kind
S1
Claims (1)

The ornamental design for an ultracapacitor module assembly design, as shown and described.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 6, 2021
From: MAXWELL TECHNOLOGIES, INC.
To: UCAP POWER, INC.
Reel/Frame 057830/0647 →
RELEASE OF SECURITY INTEREST Recorded May 24, 2019
From: EAST WEST BANK
To: MAXWELL TECHNOLOGIES, INC.
Reel/Frame 051441/0005 →
RELEASE OF SECURITY INTEREST Recorded May 16, 2019
From: EAST WEST BANK
To: MAXWELL TECHNOLOGIES, INC.
Reel/Frame 049216/0304 →
SECURITY INTEREST Recorded Jul 6, 2015
From: MAXWELL TECHNOLOGIES, INC.
To: EAST WEST BANK
Reel/Frame 036064/0636 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 18, 2007
From: STANLEY, STEVE; JOHNSTONE, JEFFREY
To: MAXWELL TECHNOLOGIES, INC.
Reel/Frame 019443/0486 →