IP Library › Granted Patent US 577,977
Granted Patent S1
US 577,977 · App. 29/289,632 · Granted Oct 7, 2008

Bonding device clamp

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Quick Facts
Patent No.
US 577,977
App. No.
29/289,632
Granted
Oct 7, 2008
Kind
S1
Claims (1)

The ornamental design for a bonding device clamp, as shown and described.

Assignments (1)
CHANGE OF NAME Recorded Mar 5, 2014
From: THOMAS & BETTS INTERNATIONAL, INC.
To: THOMAS & BETTS INTERNATIONAL LLC
Reel/Frame 032388/0428 →