IP Library Granted Patent US 608,474
Granted Patent S1
US 608,474 · App. 29/336,925 · Granted Jan 19, 2010

Architectural panel with buri palm and reed

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Quick Facts
Patent No.
US 608,474
App. No.
29/336,925
Granted
Jan 19, 2010
Kind
S1
Claims (1)

The ornamental design for architectural panel with buri palm and reed, as shown and described.

Assignments (1)
MERGER Recorded May 7, 2014
From: 3FORM, INC.
To: 3FORM, LLC
Reel/Frame 032845/0412 →