IP Library › Granted Patent US 638,096
Granted Patent S1
US 638,096 · App. 29/338,029 · Granted May 17, 2011

Wafer-shaped hollow fiber module

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Quick Facts
Patent No.
US 638,096
App. No.
29/338,029
Granted
May 17, 2011
Kind
S1
Claims (1)

The ornamental design for a wafer-shaped hollow fiber module, as shown and described.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 1, 2024
From: 3M INNOVATIVE PROPERTIES COMPANY
To: SOLVENTUM INTELLECTUAL PROPERTIES COMPANY
Reel/Frame 066438/0323 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 3, 2015
From: CELGARD, LLC
To: 3M INNOVATIVE PROPERTES COMPANY
Reel/Frame 036947/0478 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN UNITED STATES PATENTS Recorded Aug 27, 2015
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: CELGARD, LLC (F/K/A/ CELGARD, INC.)
Reel/Frame 036485/0267 →
PATENT SECURITY AGREEMENT Recorded Apr 8, 2014
From: CELGARD, LLC (F/K/A CELGARD, INC.)
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 032631/0655 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 3, 2009
From: TAYLOR, GARETH P.
To: CELGARD LLC
Reel/Frame 022774/0730 →