Granted Patent
S1
US 611,800 · App. 29/339,981 · Granted Mar 16, 2010
Low-profile cap for modular panel systems
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Claims (1)
The ornamental design for a low-profile cap for modular panel systems, as shown and described.
Assignments (4)
RELEASE OF SECURITY INTEREST
Recorded May 9, 2024
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: 3FORM, LLC
Reel/Frame 067375/0581 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT
Recorded Nov 17, 2022
From: 3FORM, LLC; 3 DAY BLINDS LLC; COMFORTEX CORPORATION; DEFENDER SCREENS INTERNATIONAL LLC; HUNTER DOUGLAS WINDOW DESIGNS, LLC; LEVOLOR, INC.; VISTA PRODUCTS, INC.; HUNTER DOUGLAS INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 061958/0711 →
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Aug 7, 2009
From: GHATIKAR, VENUGOAL R.
To: 3FORM, INC.
Reel/Frame 023069/0390 →