IP Library › Granted Patent US 624,885
Granted Patent S1
US 624,885 · App. 29/354,644 · Granted Oct 5, 2010

LED package structure

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Quick Facts
Patent No.
US 624,885
App. No.
29/354,644
Granted
Oct 5, 2010
Kind
S1
Claims (1)

The ornamental design for a “LED package structure,” as shown and described.

Assignments (3)
CHANGE OF NAME Recorded Nov 5, 2013
From: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
To: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED
Reel/Frame 031582/0958 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 27, 2010
From: LIN, CHEN-HSIU; KAO, CHIH-CHIANG
To: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.; LITE-ON TECHNOLOGY CORPORATION
Reel/Frame 023856/0374 →
SECURITY INTEREST Recorded Jul 9, 1993
From: PORTA SYSTEMS
To: CHEMICAL BANK
Reel/Frame 006680/0415 →