IP Library › Granted Patent US 666,974
Granted Patent S1
US 666,974 · App. 29/375,595 · Granted Sep 11, 2012

Y-junction interconnect module

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Quick Facts
Patent No.
US 666,974
App. No.
29/375,595
Granted
Sep 11, 2012
Kind
S1
Claims (1)

The ornamental design for a Y-junction interconnect module, as shown and described.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2018
From: SUNPOWER CORPORATION
To: ENPHASE ENERGY, INC.
Reel/Frame 046964/0203 →
RELEASE OF SECURITY INTEREST Recorded Dec 19, 2014
From: SILICON VALLEY BANK
To: SOLARBRIDGE TECHNOLOGIES, INC.
Reel/Frame 034681/0475 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 19, 2014
From: SOLARBRIDGE TECHNOLOGIES, INC.
To: SUNPOWER CORPORATION
Reel/Frame 034687/0232 →
SECURITY INTEREST Recorded Sep 2, 2014
From: SOLARBRIDGE TECHNOLOGIES, INC.
To: SILICON VALLEY BANK
Reel/Frame 033677/0870 →