IP Library › Granted Patent US 667,079
Granted Patent S1
US 667,079 · App. 29/404,366 · Granted Sep 11, 2012

Soldered mini-link mechanism

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Quick Facts
Patent No.
US 667,079
App. No.
29/404,366
Granted
Sep 11, 2012
Kind
S1
Claims (1)

The ornamental design for a soldered mini-link mechanism, as shown and described.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Jul 24, 2024
From: JPMORGAN CHASE BANK, N.A.
To: THE RELIABLE AUTOMATIC SPRINKLER CO. INC.
Reel/Frame 068654/0001 →
SECURITY INTEREST Recorded Jul 11, 2024
From: ASC ENGINEERED SOLUTIONS, LLC; THE RELIABLE AUTOMATIC SPRINKLER CO. INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 068294/0382 →
SECURITY INTEREST Recorded Jul 10, 2024
From: THE RELIABLE AUTOMATIC SPRINKLER CO. INC.
To: KKR LOAN ADMINISTRATION SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 068264/0065 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2024
From: THE RELIABLE AUTOMATIC SPRINKLER CO. INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067487/0665 →