IP Library › Granted Patent US 720,310
Granted Patent S1
US 720,310 · App. 29/439,581 · Granted Dec 30, 2014

Triangular semiconductor die

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Quick Facts
Patent No.
US 720,310
App. No.
29/439,581
Granted
Dec 30, 2014
Kind
S1
Claims (1)

The ornamental design for triangular semiconductor die, as shown and described.

Assignments (2)
NUNC PRO TUNC ASSIGNMENT Recorded Feb 21, 2022
From: ECOSENSE LIGHTING INC.
To: KORRUS, INC.
Reel/Frame 059239/0614 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2020
From: SORAA, INC.
To: ECOSENSE LIGHTING, INC.
Reel/Frame 052725/0022 →