IP Library › Granted Patent US 763,806
Granted Patent S1
US 763,806 · App. 29/456,727 · Granted Aug 16, 2016

Triangular semiconductor die

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Quick Facts
Patent No.
US 763,806
App. No.
29/456,727
Granted
Aug 16, 2016
Kind
S1
Claims (1)

The ornamental design for triangular semiconductor die, as shown and described.

Assignments (3)
NUNC PRO TUNC ASSIGNMENT Recorded Feb 21, 2022
From: ECOSENSE LIGHTING INC.
To: KORRUS, INC.
Reel/Frame 059239/0614 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2020
From: SORAA, INC.
To: ECOSENSE LIGHTING, INC.
Reel/Frame 052725/0022 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 30, 2013
From: SHARMA, RAJAT; FELKER, ANDREW
To: SORAA, INC.
Reel/Frame 030905/0017 →