IP Library › Granted Patent US 756,317
Granted Patent S1
US 756,317 · App. 29/500,475 · Granted May 17, 2016

Layout for contact pads and connection bridges of a transponder chip module

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Quick Facts
Patent No.
US 756,317
App. No.
29/500,475
Granted
May 17, 2016
Kind
S1
Claims (1)

The ornamental design for a layout for contact pads and connection bridges of a transponder chip module, as shown and described.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 14, 2021
From: FÉINICS AMATECH TEORANTA
To: AMATECH GROUP LIMITED
Reel/Frame 058960/0347 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 14, 2015
From: FINN, DAVID; LOTYA, MUSTAFA
To: FÉINICS AMATECH TEORANTA
Reel/Frame 034716/0715 →