IP Library › Granted Patent US 750,758
Granted Patent S1
US 750,758 · App. 29/510,179 · Granted Mar 1, 2016

Dual material Y-connector with tethered caps

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Quick Facts
Patent No.
US 750,758
App. No.
29/510,179
Granted
Mar 1, 2016
Kind
S1
Claims (1)

The ornamental design for a dual material Y-connector with tethered caps, as shown and described.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Jun 30, 2022
From: CITIBANK, N.A.
To: AVENT, INC.; AVANOS MEDICAL SALES, LLC
Reel/Frame 060557/0062 →
SECURITY INTEREST Recorded Jun 24, 2022
From: AVENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 060441/0445 →
INTELLECTUAL PROPERTY SECURITY INTEREST ASSIGNMENT AGREEMENT Recorded Jan 23, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: CITIBANK, N.A.
Reel/Frame 048173/0137 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2017
From: CORPAK MEDSYSTEMS, INC.
To: AVENT, INC.
Reel/Frame 044458/0194 →
SECURITY INTEREST Recorded Jun 6, 2017
From: CORPAK MEDSYSTEMS, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042615/0531 →
RELEASE OF SECURITY INTEREST Recorded May 3, 2016
From: FIFTH THIRD BANK
To: CORPAK MEDSYSTEMS, INC.
Reel/Frame 038445/0887 →
SECURITY INTEREST Recorded Dec 30, 2014
From: CORPAK MEDSYSTEMS, INC.
To: FIFTH THIRD BANK
Reel/Frame 034601/0637 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 25, 2014
From: KOELPER, CRYSTAL E.; MORICI, JOHN L.
To: CORPAK MEDSYSTEMS, INC.
Reel/Frame 034264/0470 →