Granted Patent
S1
US 787,469 · App. 29/538,163 · Granted May 23, 2017
Headphone
Assignee:
Soundchip SA
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Claims (1)
The ornamental design for headphone, as shown and described.
Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Aug 29, 2023
From: SOUNDCHIP SA
To: DSP GROUP LTD.
Reel/Frame 064743/0255 →
Priority Claims (1)
EM 002645234
· Mar 3, 2015
· regional