IP Library › Granted Patent US 803,171
Granted Patent S1
US 803,171 · App. 29/539,504 · Granted Nov 21, 2017

Array of triangular semiconductor dies

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Quick Facts
Patent No.
US 803,171
App. No.
29/539,504
Granted
Nov 21, 2017
Kind
S1
Claims (1)

The ornamental design for an array of triangular semiconductor dies, as shown and described.

Assignments (2)
NUNC PRO TUNC ASSIGNMENT Recorded Feb 21, 2022
From: ECOSENSE LIGHTING INC.
To: KORRUS, INC.
Reel/Frame 059239/0614 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2020
From: SORAA, INC.
To: ECOSENSE LIGHTING, INC.
Reel/Frame 052725/0022 →