IP Library Granted Patent US 800,665
Granted Patent S1
US 800,665 · App. 29/541,817 · Granted Oct 24, 2017

Connection module

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Quick Facts
Patent No.
US 800,665
App. No.
29/541,817
Granted
Oct 24, 2017
Kind
S1
Claims (1)

The ornamental design for a connection module, as shown and described.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2019
From: HSBC BANK PLC
To: TELIT TECHNOLOGIES (CYPRUS) LIMITED
Reel/Frame 048465/0611 →
SECURITY INTEREST Recorded Oct 13, 2016
From: TELIT TECHNOLOGIES (CYPRUS) LIMITED
To: HSBC BANK PLC
Reel/Frame 040007/0140 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 16, 2015
From: DRUSCOVICH, FABRIZIO; VITTORI, BRUNO
To: TELIT TECHNOLOGIES (CYPRUS) LIMITED
Reel/Frame 036809/0280 →