IP Library Granted Patent US 806,045
Granted Patent S1
US 806,045 · App. 29/550,889 · Granted Dec 26, 2017

Solder pad

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Quick Facts
Patent No.
US 806,045
App. No.
29/550,889
Granted
Dec 26, 2017
Kind
S1
Claims (1)

The ornamental design for a solder pad, as shown and described.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →
RELEASE OF SECURITY INTEREST Recorded Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
SECURITY INTEREST Recorded Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 19, 2018
From: LUMILEDS HOLDING B.V.
To: LUMILEDS LLC
Reel/Frame 044669/0351 →
SECURITY INTEREST Recorded Jul 7, 2017
From: LUMILEDS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 043108/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2016
From: PAREKH, KETAN S.
To: LUMILEDS HOLDING B.V.
Reel/Frame 038071/0291 →